Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11949090 | Winding-type electrode body of non-aqueous electrolyte secondary battery, and non-aqueous electrolyte secondary battery | Hajime Nishino, Takanori Maruo | 2024-04-02 |
| 10186479 | Semiconductor device, package, and vehicle | Hidenori Katsumura, Shinya Tokunaga, Masaya Sumita, Hiroyoshi Yoshida, Kazuhide Uriu +1 more | 2019-01-22 |
| 9905501 | Semiconductor device, embedded capacitor unit, semiconductor package, and method of manufacturing embedded capacitor unit | Hidenori Katsumura, Shinya Tokunaga | 2018-02-27 |
| 7968800 | Passive component incorporating interposer | Tatsuo Sasaoka, Eiji Kawamoto, Kazuhiko Honjo, Toshiyuki Asahi, Chie Sasaki +1 more | 2011-06-28 |
| 7888789 | Transfer material used for producing a wiring substrate | Shingo Komatsu, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2011-02-15 |
| 7821795 | Multilayer wiring board | Yoshiyuki Yamamoto, Toshiyuki Asahi, Katsumasa Miki, Masaaki Katsumata, Yoshiyuki Saitou +1 more | 2010-10-26 |
| 7667977 | Mounting board, mounted body, and electronic equipment using the same | Toshiyuki Asahi, Katsumasa Miki, Yoshiyuki Yamamoto, Hiroyuki Ishitomi, Tsuyoshi Himori | 2010-02-23 |
| 7394663 | Electronic component built-in module and method of manufacturing the same | Yoshihisa Yamashita, Koichi Hirano, Toshiyuki Asahi, Seiichi Nakatani | 2008-07-01 |
| 7390692 | Semiconductor device and method for manufacturing the same | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani | 2008-06-24 |
| 7341890 | Circuit board with built-in electronic component and method for manufacturing the same | Yukihiro Ishimaru, Tousaku Nishiyama, Toshiyuki Asahi | 2008-03-11 |
| 7294587 | Component built-in module and method for producing the same | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani | 2007-11-13 |
| 7248482 | Module with built-in circuit component and method for producing the same | Toshiyuki Asahi, Yutaka Taguchi, Seiichi Nakatani, Toshio Fujii | 2007-07-24 |
| 7246421 | Method for manufacturing surface acoustic wave device | Akihiko Namba, Keiji Onishi, Katsunori Moritoki | 2007-07-24 |
| 7242823 | Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus | Seiji Karashima, Seiichi Nakatani, Toshiyuki Asahi, Takashi Ichiryu | 2007-07-10 |
| 7198996 | Component built-in module and method for producing the same | Seiichi Nakatani, Toshiyuki Asahi, Shingo Komatsu | 2007-04-03 |
| 7187071 | Composite electronic component | Michiaki Tsuneoka, Masaaki Katsumata, Joji Fujiwara | 2007-03-06 |
| 7180169 | Circuit component built-in module and method for manufacturing the same | Yukihiro Ishimaru, Toshiyuki Asahi | 2007-02-20 |
| 7141884 | Module with a built-in semiconductor and method for producing the same | Toshiyuki Kojima, Seiichi Nakatani, Yoshiyuki Yamamoto | 2006-11-28 |
| 7134198 | Method for manufacturing electric element built-in module with sealed electric element | Seiichi Nakatani, Yoshihiro Bessho, Keiji Onishi | 2006-11-14 |
| 7136543 | Mount assembly, optical transmission line and photoelectric circuit board | Tousaku Nishiyama, Yukihiro Ishimaru, Toshiyuki Asahi, Seiji Karashima | 2006-11-14 |
| 7132756 | Semiconductor device and method for manufacturing the same | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani | 2006-11-07 |
| 7091593 | Circuit board with built-in electronic component and method for manufacturing the same | Yukihiro Ishimaru, Tousaku Nishiyama, Toshiyuki Asahi | 2006-08-15 |
| 7061100 | Semiconductor built-in millimeter-wave band module | Hideki Iwaki, Yutaka Taguchi, Tetsuyosi Ogura, Toshiyuki Asahi, Tousaku Nishiyama +1 more | 2006-06-13 |
| 7018866 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Toshiyuki Asahi, Shingo Komatsu, Yoshiyuki Yamamoto, Seiichi Nakatani, Satoru Yuhaku +1 more | 2006-03-28 |
| 7013561 | Method for producing a capacitor-embedded circuit board | Seiichi Nakatani, Koichi Hirano, Mikinari Shimada | 2006-03-21 |