Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056632 | Thermoelectric conversion substrate, thermoelectric conversion module and method for producing thermoelectric conversion substrate | Takuji Aoyama, Satoshi Maeshima, Junya Tanaka, Noboru Yamamoto | 2021-07-06 |
| 11011319 | Electronic component | Shinji Ishitani, Renki Yamazaki | 2021-05-18 |
| 10679920 | Semiconductor device having semiconductor package in a wiring board opening | Hideki Niimi | 2020-06-09 |
| 10629792 | Wiring substrate and production method thereof | — | 2020-04-21 |
| 9246073 | Mounting structure, and method of manufacturing mounting structure | Kaori Toyoda, Kentaro Nishiwaki, Hiroki Ikeuchi, Hiroshi Nasu | 2016-01-26 |
| 9240369 | Encapsulated semiconductor device and method for manufacturing the same | Masanori Minamio | 2016-01-19 |
| 9030003 | Encapsulated semiconductor device and method for manufacturing the same | Masanori Minamio | 2015-05-12 |
| 9013029 | Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same | Masanori Minamio | 2015-04-21 |
| 8686545 | Semiconductor device and method for manufacturing the same | Masanori Minamio | 2014-04-01 |
| 8240539 | Joining apparatus with UV cleaning | Kazushi Higashi, Shinji Ishitani | 2012-08-14 |
| 7968800 | Passive component incorporating interposer | Yasuhiro Sugaya, Eiji Kawamoto, Kazuhiko Honjo, Toshiyuki Asahi, Chie Sasaki +1 more | 2011-06-28 |
| 7907420 | Bare chip mounted structure and mounting method | Koichi Nagai, Minoru Yamamoto, Ken Takano, Kazumichi Shimizu | 2011-03-15 |
| 7659148 | Bonding method and apparatus | Satoshi Horie, Isamu Aokura, Yoshihiko Yagi, Kazuki Fukada | 2010-02-09 |
| 6996889 | Electronic part mounting apparatus and method | Kazushi Higashi, Satoshi Horie, Takashi Omura | 2006-02-14 |
| 6949144 | Low pressure plasma processing apparatus and method | Naoki Suzuki, Ken Kobayashi | 2005-09-27 |
| 6902101 | Bump bonding method apparatus | Satoshi Horie, Takahiro Yonezawa, Hiroyuki Kiyomura, Tetsuya Tokunaga | 2005-06-07 |
| 6712111 | Bonding method and apparatus | Tetsuya Tokunaga, Takahiro Yonezawa, Hiroyuki Kiyomura | 2004-03-30 |
| 6680221 | Bare chip mounting method and bare chip mounting system | Tetsuya Tokunaga, Takahiro Yonezawa, Hiroyuki Kiyomura, Satoshi Horie | 2004-01-20 |
| 6667250 | Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method | Naoki Suzuki, Takahiro Yonezawa, Satoshi Horie | 2003-12-23 |
| 6474538 | Bonding apparatus and bonding method | Takahiro Yonezawa, Akihiro Yamamoto, Hiroyuki Kiyomura, Tetsuya Tokunaga, Masahiko Hashimoto | 2002-11-05 |