Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10363685 | Ingot cutting apparatus, and load detecting device used in ingot cutting apparatus | Masayuki Takahashi, Kazumi Koketsu, Yotaro Tsuchiya | 2019-07-30 |
| 9438379 | Communication device, communication program, communication method, and information processing device | Asako Sakashita, Suzuka Morotomi, Takuro Kaneko, Naoya Kumada, Yukio Yasumoto | 2016-09-06 |
| 9402092 | Communication device, communication program, and communication method | Suzuka Morotomi, Takuro Kaneko, Naoya Kumada, Yukio Yasumoto | 2016-07-26 |
| 8809693 | Three-dimensional circuit board | Daisuke Sakurai | 2014-08-19 |
| 8575751 | Conductive bump, method for producing the same, and electronic component mounted structure | Daisuke Sakurai | 2013-11-05 |
| 8208270 | Substrate joining member and three-dimensional structure using the same | Masato Mori, Daido Komyoji, Koichi Nagai | 2012-06-26 |
| 8159829 | Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate | Masato Mori, Daido Komyoji, Koichi Nagai | 2012-04-17 |
| 8134081 | Three-dimensional circuit board and its manufacturing method | Daisuke Sakurai | 2012-03-13 |
| 8120188 | Electronic component mounting structure and method for manufacturing the same | Daisuke Sakurai | 2012-02-21 |
| 8119449 | Method of manufacturing an electronic part mounting structure | Daisuke Sakurai | 2012-02-21 |
| 8033016 | Method for manufacturing an electrode and electrode component mounted body | Kunio Hibino, Yoshihiro Tomura, Kazuhiro Nishikawa | 2011-10-11 |
| 8018731 | Interconnect substrate and electronic circuit mounted structure | Daisuke Sakurai, Masato Mori | 2011-09-13 |
| 7928566 | Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device | Daisuke Sakurai | 2011-04-19 |
| 7845954 | Interconnecting board and three-dimensional wiring structure using it | Yoshihiro Tomura, Yasushi Nakagiri, Kunio Hibino, Akihiro Miyashita, Masahiro Ono +1 more | 2010-12-07 |
| 7762819 | Substrate connecting member and connecting structure | Masato Mori, Masahiro Ono, Yoshihiro Tomura, Kunio Hibino, Yasushi Nakagiri +2 more | 2010-07-27 |
| 7659148 | Bonding method and apparatus | Tatsuo Sasaoka, Satoshi Horie, Isamu Aokura, Kazuki Fukada | 2010-02-09 |
| 7613010 | Stereoscopic electronic circuit device, and relay board and relay frame used therein | Masahiro Ono, Shigeru Kondo, Kazuhiro Nishikawa, Kazuto Nishida | 2009-11-03 |
| 7071090 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshifumi Kitayama, Hiroyuki Otani | 2006-07-04 |
| 6985363 | Card type recording medium and production method therefor | Kazuhiro Uji, Michiro Yoshino, Kenichi Yamamoto | 2006-01-10 |
| 6966964 | Method and apparatus for manufacturing semiconductor device | Koujiro Nakamura, Michiro Yoshino, Kazuto Nishida | 2005-11-22 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |
| 6787922 | Semiconductor chip—mounting board | Hiroyuki Otani, Kenichi Yamamoto | 2004-09-07 |
| 6651320 | Method for mounting semiconductor element to circuit board | Hiroyuki Otani | 2003-11-25 |
| 6566165 | Method for mounting a semiconductor chip to a semiconductor chip-mounting board | Hiroyuki Otani, Kenichi Yamamoto | 2003-05-20 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshifumi Kitayama, Hiroyuki Otani | 2001-03-27 |