Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236868 | Process for producing polyurethane elastomer foams | Tetsuya Watanabe, Takashi Chiba | 2012-08-07 |
| 8007627 | Electronic component mounting method and apparatus | Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada | 2011-08-30 |
| 7683482 | Electronic component unit | Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada | 2010-03-23 |
| 7430644 | Storage device, control method for partitioning logical memory devices, and medium embodying program for partitioning logical memory devices | — | 2008-09-30 |
| 7355126 | Electronic parts packaging method and electronic parts package | Hidenobu Nishikawa, Kazuto Nishida, Kazumichi Shimizu, Shuji Ono | 2008-04-08 |
| 7071090 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama | 2006-07-04 |
| 7060528 | Method for mounting a semiconductor element to an interposer by compression bonding | Hidenobu Nishikawa, Kazuto Nishida, Kazumichi Shimizu | 2006-06-13 |
| 6971167 | Multilayered circuit board forming method and multilayered circuit board | Kazuhiro Nishikawa, Norihito Tsukahara | 2005-12-06 |
| 6926796 | Electronic parts mounting method and device therefor | Kazuto Nishida, Hidenobu Nishikawa, Yoshinori Wada | 2005-08-09 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama | 2005-05-17 |
| 6825055 | Method for assembling integral type electronic component and integral type electronic component | Kazushi Higashi, Norihito Tsukahara | 2004-11-30 |
| 6787922 | Semiconductor chip—mounting board | Yoshihiko Yagi, Kenichi Yamamoto | 2004-09-07 |
| 6651320 | Method for mounting semiconductor element to circuit board | Yoshihiko Yagi | 2003-11-25 |
| 6566165 | Method for mounting a semiconductor chip to a semiconductor chip-mounting board | Yoshihiko Yagi, Kenichi Yamamoto | 2003-05-20 |
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6453811 | Printing method and printing apparatus | Takaaki Higashida, Takahiko Iwaki | 2002-09-24 |
| 6328196 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2001-12-11 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama | 2001-03-27 |
| 6193136 | Component mounting method and apparatus | Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2001-02-27 |
| 6135024 | Screen printing method and printing apparatus | Takaaki Higashida, Takahiko Iwaki | 2000-10-24 |
| 6061248 | Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon | Yoshihiko Yagi, Kenichi Yamamoto | 2000-05-09 |
| 6055724 | Method and device for sealing IC chip | Kenichi Nishino, Shinji Kanayama, Kohei Enchi, Hiroyuki Yoshida | 2000-05-02 |