Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada +4 more | 2002-08-27 |
| 6328196 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Takahiro Yonezawa, Kazushi Higashi +2 more | 2001-12-11 |
| 5899140 | Bump levelling method and bump levelling apparatus | Akihiro Yamamoto, Makoto Imanishi, Takahiro Yonezawa, Osamu Nakao | 1999-05-04 |
| 5854745 | Method and apparatus for mounting electronic component | Nobuhiko Muraoka, Shinji Kanayama, Masaru Ichihara, Shuichi Hirata, Nobuhisa Watanabe | 1998-12-29 |