Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8001678 | Component mounting apparatus | Akira Kabeshita, Kurayasu Hamasaki, Noriyuki Tani, Yoichi Makino | 2011-08-23 |
| 7938929 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2011-05-10 |
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita +5 more | 2011-01-04 |
| 7827677 | Component mounting apparatus | Yasuharu Ueno, Shinji Kanayama, Takashi Shimizu, Satoshi Shida, Shunji Onobori | 2010-11-09 |
| 7637714 | Apparatus and method for removing semiconductor chip | Akira Kabeshita, Kurayasu Hamasaki, Yoichi Makino, Noriyuki Tani | 2009-12-29 |
| 7549567 | Component mounting tool, and method and apparatus for mounting component using this tool | Kazushi Higashi, Shinji Kanayama, Kenji Takahashi | 2009-06-23 |
| 7490652 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2009-02-17 |
| 7437818 | Component mounting method | Akira Kabeshita, Kurayasu Hamasaki, Noriyuki Tani, Yoichi Makino | 2008-10-21 |
| 7296727 | Apparatus and method for mounting electronic components | Shunji Onobori, Shuichi Hirata, Masakazu Yamano, Kazuya Yamamoto, Satoshi Shida +2 more | 2007-11-20 |
| 7290331 | Component mounting apparatus and component mounting method | Shunji Onobori, Shuichi Hirata, Tomoaki Nakanishi | 2007-11-06 |
| 7281322 | Component mounting method | Shunji Onobori, Shuichi Hirata, Tomoaki Nakanishi | 2007-10-16 |
| 7229854 | Electronic component mounting method and apparatus and ultrasonic bonding head | Takaharu Mae, Yasuharu Ueno, Akira Yamada, Shinji Kanayama, Makoto Akita +5 more | 2007-06-12 |
| 7219419 | Component mounting apparatus including a polishing device | Kazushi Higashi, Shinji Kanayama, Kenji Takahashi | 2007-05-22 |
| 7020953 | Apparatus and method for mounting component | Yasuharu Ueno, Shinji Kanayama, Satoshi Shida, Shunji Onobori | 2006-04-04 |
| 6706130 | Method and device for frictional connection and holding tool used for the frictional connection device | Shinji Kanayama, Satoshi Shida, Yasuharu Ueno | 2004-03-16 |
| 6572005 | Bump-joining method | Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa | 2003-06-03 |
| 6544377 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2003-04-08 |
| 6506222 | Method and apparatus for mounting component | Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida +1 more | 2003-01-14 |
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Hiroyuki Otani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |
| 6321973 | Bump joining method | Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa | 2001-11-27 |
| 6264704 | Method and apparatus for mounting component | Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida +1 more | 2001-07-24 |
| 6246789 | Component mounting apparatus and method | Naoto Hosotani, Koichi Morita, Shunji Onobori, Kenichi Nishino | 2001-06-12 |
| 6193136 | Component mounting method and apparatus | Kazushi Higashi, Hiroyuki Otani, Shinji Kanayama, Kenji Takahashi | 2001-02-27 |