Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9354107 | Item registration apparatus and measuring device | Naokazu Sato, Fumikatu Saitoh | 2016-05-31 |
| 9123214 | Commodity sales data processing device | — | 2015-09-01 |
| 7938929 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori | 2011-05-10 |
| 7490652 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori | 2009-02-17 |
| 7220922 | Electronic component, component mounting equipment, and component mounting method | Shinji Kanayama, Shinjiro Tsuji, Masayuki Ida, Tomotaka Nishimoto | 2007-05-22 |
| 6647616 | Bump bonding unit with tray storage and transport apparatuses | Nobuya Matsumura, Hiroyuki Kiyomura, Kenji Takahashi, Shinji Kanayama | 2003-11-18 |
| 6544377 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori | 2003-04-08 |
| 6246789 | Component mounting apparatus and method | Naoto Hosotani, Koichi Morita, Shunji Onobori, Shozo Minamitani | 2001-06-12 |
| 6129203 | IC discarding apparatus for flip chip mounting facility | Hiroyuki Kiyomura, Shinji Kanayama, Nobuya Matsumura, Kenji Takahashi, Naomi Kainou | 2000-10-10 |
| 6055724 | Method and device for sealing IC chip | Shinji Kanayama, Hiroyuki Otani, Kohei Enchi, Hiroyuki Yoshida | 2000-05-02 |
| 5582341 | Bonding apparatus for terminal component | Shinji Kanayama, Akira Kabeshita, Satoshi Ohnakada, Nobuhiko Muraoka | 1996-12-10 |
| 5462626 | Method of bonding an external lead and a tool therefor | Shinji Kanayama, Akira Kabeshita, Satoshi Ohnakada, Takahiko Murata, Kazuhiro Kimura +1 more | 1995-10-31 |
| 5164448 | Curable unsaturated polyester dresin composition | Yasuhiro Mishima, Hisayuki Iwai, Sanzi Aoki, Mitsuo Kinoshita, Tatsuhiko Ozaki | 1992-11-17 |
| 5064900 | Curable unsaturated polyester resin composition | Hisayuki Iwai, Yasuhrio Mishima, Ken Hatta, Sanji Aoki, Tatsuhiko Ozaki +1 more | 1991-11-12 |
| 4952652 | Unsaturated polyester compositions and molded products therefrom | Takashi Shibata, Sanzi Aoki, Yasuhiro Mishima, Hisayuki Iwai, Ken Hatta | 1990-08-28 |
| 4932857 | Compression molding apparatus | Nobuyuki Nakagawa, Hiroshi Maekawa | 1990-06-12 |
| 4640950 | Thixotropic polyurethane resin compositions | Atsuo Kobayashi, Sachio Higashi, Shinichiro Yamamoto, Kiyoshi Yasuda | 1987-02-03 |
| 4603181 | In-mold coating composition | Hiromu Miyashita, Tadao Fukui | 1986-07-29 |
| 4456744 | Composition for producing polyurethane resin at ambient temperature | Yoshio Kamatani, Michio Tanaka, Kyuya Yamazaki | 1984-06-26 |