Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6902101 | Bump bonding method apparatus | Satoshi Horie, Takahiro Yonezawa, Tetsuya Tokunaga, Tatsuo Sasaoka | 2005-06-07 |
| 6712111 | Bonding method and apparatus | Tetsuya Tokunaga, Takahiro Yonezawa, Tatsuo Sasaoka | 2004-03-30 |
| 6680221 | Bare chip mounting method and bare chip mounting system | Tetsuya Tokunaga, Takahiro Yonezawa, Tatsuo Sasaoka, Satoshi Horie | 2004-01-20 |
| 6647616 | Bump bonding unit with tray storage and transport apparatuses | Nobuya Matsumura, Kenichi Nishino, Kenji Takahashi, Shinji Kanayama | 2003-11-18 |
| 6474538 | Bonding apparatus and bonding method | Takahiro Yonezawa, Akihiro Yamamoto, Tetsuya Tokunaga, Tatsuo Sasaoka, Masahiko Hashimoto | 2002-11-05 |
| 6467158 | Component feeder with load position alignment recognition | Shinji Kanayama, Nobuya Matsumura, Kenji Takahashi, Hiroshi Nasu | 2002-10-22 |
| 6129203 | IC discarding apparatus for flip chip mounting facility | Shinji Kanayama, Nobuya Matsumura, Kenichi Nishino, Kenji Takahashi, Naomi Kainou | 2000-10-10 |