Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354837 | Plasma processing method and plasma processing apparatus | Takayuki Katsunuma, Shinya Ishikawa, Koki Tanaka, Sho Kumakura | 2025-07-08 |
| 8624649 | Delay measuring circuit and delay measuring method | — | 2014-01-07 |
| 7246430 | Electronic component mounting apparatus and electronic component mounting method | Ken Kobayashi, Mikio Hasegawa, Hiroshi Nasu, Makoto Imanishi, Katsuhiko Watanabe | 2007-07-24 |
| 7071090 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2006-07-04 |
| 6902101 | Bump bonding method apparatus | Satoshi Horie, Hiroyuki Kiyomura, Tetsuya Tokunaga, Tatsuo Sasaoka | 2005-06-07 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |
| 6712111 | Bonding method and apparatus | Tetsuya Tokunaga, Hiroyuki Kiyomura, Tatsuo Sasaoka | 2004-03-30 |
| 6680221 | Bare chip mounting method and bare chip mounting system | Tetsuya Tokunaga, Hiroyuki Kiyomura, Tatsuo Sasaoka, Satoshi Horie | 2004-01-20 |
| 6667250 | Film substrate treatment apparatus, film substrate treatment method, and film substrate transport method | Tatsuo Sasaoka, Naoki Suzuki, Satoshi Horie | 2003-12-23 |
| 6619535 | Working method for holding a work object by suction | Makoto Imanishi, Shinji Kanayama, Ryoichiro Katano, Takaharu Mae | 2003-09-16 |
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Kazushi Higashi +2 more | 2002-11-19 |
| 6474538 | Bonding apparatus and bonding method | Akihiro Yamamoto, Hiroyuki Kiyomura, Tetsuya Tokunaga, Tatsuo Sasaoka, Masahiko Hashimoto | 2002-11-05 |
| 6332268 | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Makoto Imanishi, Yoshifumi Kitayama, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada +1 more | 2001-12-25 |
| 6328196 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Kazushi Higashi +2 more | 2001-12-11 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Kazushi Higashi, Norihito Tsukahara, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2001-03-27 |
| 6017812 | Bump bonding method and bump bonding apparatus | Osamu Nakao, Shinji Kanayama, Akihiro Yamamoto, Makoto Imanishi, Koichi Yoshida | 2000-01-25 |
| 5899375 | Bump bonder with a discard bonding area | Koichi Yoshida, Akihiro Yamamoto, Makoto Imanishi | 1999-05-04 |
| 5899140 | Bump levelling method and bump levelling apparatus | Akihiro Yamamoto, Makoto Imanishi, Shinzo Eguchi, Osamu Nakao | 1999-05-04 |
| 5686353 | Semiconductor device and manufacturing method thereof | Yoshihiko Yagi, Kazushi Higashi, Norihito Tsukahara, Koichi Kumagai | 1997-11-11 |
| 5667130 | Ultrasonic wire bonding apparatus and method | Makoto Morita, Masaru Nagaike, Richard Gueler, Makoto Imanishi | 1997-09-16 |
| 5457874 | Mounting apparatus of electronic component | Wataru Hirai, Muneyoshi Fujiwara, Kunio Sakurai, Naohiko Chimura, Hiroshi Ohta | 1995-10-17 |
| 5339248 | Apparatus for mounting electronic component on substrate | Muneyoshi Fujiwara, Wataru Hirai, Kunio Sakurai | 1994-08-16 |