Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8358018 | Resin sealing structure for electronic component and resin sealing method for electronic component | Yoshihiro Tomura, Kentaro Kumazawa | 2013-01-22 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore | Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2008-06-17 |
| 7350684 | Apparatus and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama +3 more | 2008-04-01 |
| 7246430 | Electronic component mounting apparatus and electronic component mounting method | Takahiro Yonezawa, Ken Kobayashi, Mikio Hasegawa, Hiroshi Nasu, Katsuhiko Watanabe | 2007-07-24 |
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama +3 more | 2005-06-28 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Shoriki Narita, Masahiko Ikeya, Shinji Kanayama, Takaharu Mae | 2004-09-07 |
| 6619535 | Working method for holding a work object by suction | Takahiro Yonezawa, Shinji Kanayama, Ryoichiro Katano, Takaharu Mae | 2003-09-16 |
| 6568580 | Bump bonding apparatus and method | Shoriki Narita, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2003-05-27 |
| 6527905 | Method for mounting electronic components and apparatus and dispenser used in the method | Akira Kabeshita, Kohei Enchi, Satoshi Shida | 2003-03-04 |
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2002-12-17 |
| 6481616 | Bump bonding device and bump bonding method | Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2002-05-21 |
| 6332268 | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Yoshifumi Kitayama, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada, Takahiro Yonezawa +1 more | 2001-12-25 |
| 6328196 | Bump bonding device and bump bonding method | Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2001-12-11 |
| 6329640 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2001-12-11 |
| 6302317 | Bump bonding apparatus and method | Shoriki Narita, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2001-10-16 |
| 6206066 | Apparatus for mounting an electronic component | Akira Kabeshita, Kohei Enchi, Satoshi Shida | 2001-03-27 |
| 6017812 | Bump bonding method and bump bonding apparatus | Takahiro Yonezawa, Osamu Nakao, Shinji Kanayama, Akihiro Yamamoto, Koichi Yoshida | 2000-01-25 |
| 5899140 | Bump levelling method and bump levelling apparatus | Akihiro Yamamoto, Takahiro Yonezawa, Shinzo Eguchi, Osamu Nakao | 1999-05-04 |
| 5899375 | Bump bonder with a discard bonding area | Koichi Yoshida, Akihiro Yamamoto, Takahiro Yonezawa | 1999-05-04 |
| 5783915 | Linear actuating apparatus | Satoshi Shida, Akira Kabeshita, Shinji Kanayama, Kenji Takahashi, Osamu Nakao | 1998-07-21 |
| 5667130 | Ultrasonic wire bonding apparatus and method | Makoto Morita, Masaru Nagaike, Richard Gueler, Takahiro Yonezawa | 1997-09-16 |