Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2009-04-14 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore | Makoto Imanishi, Shoriki Narita, Shinji Kanayama, Takaharu Mae | 2008-06-17 |
| 7350684 | Apparatus and method for forming bump | Shoriki Narita, Koichi Yoshida, Takaharu Mae, Shinji Kanayama, Makoto Imanishi +3 more | 2008-04-01 |
| 7052984 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-05-30 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-04-18 |
| 7021357 | Component mounting apparatus and component mounting method | Ryoichiro Katano, Shinjiro Tsuji, Shinji Kanayama, Yasutaka Tsuboi, Akimitsu Mukai +1 more | 2006-04-04 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-03-21 |
| 7005368 | BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2006-02-28 |
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Takaharu Mae, Shinji Kanayama, Makoto Imanishi +3 more | 2005-06-28 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Takaharu Mae, Shinji Kanayama | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Shoriki Narita, Shinji Kanayama, Takaharu Mae | 2004-09-07 |
| 6098868 | Bump forming method and bump bonder | Takaharu Mae, Kiyoshi Mayahara, Shoriki Narita, Masaya Watanabe, Yuichi Takakura | 2000-08-08 |