Issued Patents All Time
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7861908 | Component mounting method, component mounting apparatus, and ultrasonic bonding head | Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Makoto Akita +5 more | 2011-01-04 |
| 7827677 | Component mounting apparatus | Yasuharu Ueno, Shozo Minamitani, Takashi Shimizu, Satoshi Shida, Shunji Onobori | 2010-11-09 |
| 7797820 | Component mounting apparatus | Satoshi Shida, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe +4 more | 2010-09-21 |
| 7549567 | Component mounting tool, and method and apparatus for mounting component using this tool | Kazushi Higashi, Shozo Minamitani, Kenji Takahashi | 2009-06-23 |
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae | 2009-04-14 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore | Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Takaharu Mae | 2008-06-17 |
| 7353596 | Component mounting method | Satoshi Shida, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe +4 more | 2008-04-08 |
| 7350684 | Apparatus and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Makoto Imanishi +3 more | 2008-04-01 |
| 7229854 | Electronic component mounting method and apparatus and ultrasonic bonding head | Shozo Minamitani, Takaharu Mae, Yasuharu Ueno, Akira Yamada, Makoto Akita +5 more | 2007-06-12 |
| 7219419 | Component mounting apparatus including a polishing device | Kazushi Higashi, Shozo Minamitani, Kenji Takahashi | 2007-05-22 |
| 7220922 | Electronic component, component mounting equipment, and component mounting method | Kenichi Nishino, Shinjiro Tsuji, Masayuki Ida, Tomotaka Nishimoto | 2007-05-22 |
| 7052984 | Bump formation method and bump forming apparatus for semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae | 2006-05-30 |
| 7031509 | Method and apparatus for correcting inclination of IC on semiconductor wafer | Shoriki Narita, Masahiko Ikeya, Yasutaka Tsuboi, Takaharu Mae | 2006-04-18 |
| 7020953 | Apparatus and method for mounting component | Yasuharu Ueno, Shozo Minamitani, Satoshi Shida, Shunji Onobori | 2006-04-04 |
| 7021357 | Component mounting apparatus and component mounting method | Ryoichiro Katano, Shinjiro Tsuji, Masahiko Ikeya, Yasutaka Tsuboi, Akimitsu Mukai +1 more | 2006-04-04 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae | 2006-03-21 |
| 7005368 | BUMP FORMING APPARATUS FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVAL METHOD FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, CHARGE REMOVING UNIT FOR CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE, AND CHARGE APPEARANCE SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae | 2006-02-28 |
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Makoto Imanishi +3 more | 2005-06-28 |
| 6830989 | Method and apparatus for handling arrayed part | Satoshi Shida, Takashi Shimizu, Kenji Takahashi, Ryoji Inutsuka, Hiroyuki Yoshida | 2004-12-14 |
| 6818975 | ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE BUMP FORMING DEVICE, METHOD OF REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE DEVICE FOR REMOVING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE, AND ELECTRIC CHARGE GENERATING SEMICONDUCTOR SUBSTRATE | Shoriki Narita, Yasutaka Tsuboi, Masahiko Ikeya, Takaharu Mae | 2004-11-16 |
| 6787391 | Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor | Makoto Imanishi, Shoriki Narita, Masahiko Ikeya, Takaharu Mae | 2004-09-07 |
| 6706130 | Method and device for frictional connection and holding tool used for the frictional connection device | Shozo Minamitani, Satoshi Shida, Yasuharu Ueno | 2004-03-16 |
| 6692214 | Pusher, puller loader, unloader, and working device | Satoshi Shida, Takashi Shimizu, Ryoji Inutsuka, Hiroaki Hayashi, Yuichi Takakura | 2004-02-17 |
| 6647616 | Bump bonding unit with tray storage and transport apparatuses | Nobuya Matsumura, Hiroyuki Kiyomura, Kenichi Nishino, Kenji Takahashi | 2003-11-18 |
| 6619535 | Working method for holding a work object by suction | Makoto Imanishi, Takahiro Yonezawa, Ryoichiro Katano, Takaharu Mae | 2003-09-16 |