Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8240539 | Joining apparatus with UV cleaning | Tatsuo Sasaoka, Shinji Ishitani | 2012-08-14 |
| 8129739 | Semiconductor light emitting device and semiconductor light emitting device mounted board | Shinji Ishitani | 2012-03-06 |
| 8077447 | Electronic element package and method of manufacturing the same | Shinji Ishitani | 2011-12-13 |
| 7994634 | Semiconductor element and semiconductor element fabrication method | Takeshi Kita | 2011-08-09 |
| 7955974 | Formation of a through-electrode by inkjet deposition of resin pastes | — | 2011-06-07 |
| 7790594 | Electronic part and method of producing the same | — | 2010-09-07 |
| 7692292 | Packaged electronic element and method of producing electronic element package | Shinji Ishitani | 2010-04-06 |
| 7646095 | Semiconductor device | Kouichi Yoshida, Shinji Ishitani, Daido Komyoji | 2010-01-12 |
| 7615406 | Electronic device package manufacturing method and electronic device package | Yukihiro Maegawa | 2009-11-10 |
| 7554126 | Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device | Shinji Ishitani | 2009-06-30 |
| 7549567 | Component mounting tool, and method and apparatus for mounting component using this tool | Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2009-06-23 |
| 7350684 | Apparatus and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama +3 more | 2008-04-01 |
| 7219419 | Component mounting apparatus including a polishing device | Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2007-05-22 |
| 7071090 | Semiconductor element having protruded bump electrodes | Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2006-07-04 |
| 6996889 | Electronic part mounting apparatus and method | Tatsuo Sasaoka, Satoshi Horie, Takashi Omura | 2006-02-14 |
| 6910613 | Device and method for forming bump | Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama +3 more | 2005-06-28 |
| 6894387 | Semiconductor element having protruded bump electrodes | Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani | 2005-05-17 |
| 6825055 | Method for assembling integral type electronic component and integral type electronic component | Hiroyuki Otani, Norihito Tsukahara | 2004-11-30 |
| 6590199 | Optical information processing apparatus for use in Optical Computing, Optical image processing, and like | Hideo Kawai | 2003-07-08 |
| 6572005 | Bump-joining method | Shozo Minamitani, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa | 2003-06-03 |
| 6506222 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Satoshi Shida +1 more | 2003-01-14 |
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa +2 more | 2002-11-19 |
| 6467670 | Method and apparatus for mounting component | Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |
| 6332268 | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Makoto Imanishi, Yoshifumi Kitayama, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada +1 more | 2001-12-25 |