Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358268 | Laminating device | Ryuta Abe, Naoto Hosotani, Takahiro Kuhara | 2025-07-15 |
| 7638888 | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method | Naoki Suzuki, Akihisa Nakahashi | 2009-12-29 |
| 7615406 | Electronic device package manufacturing method and electronic device package | Kazushi Higashi | 2009-11-10 |
| 7406925 | Plasma processing method and apparatus | Tomohiro Okumura, Izuru Matsuda, Takayuki Kai, Mitsuo Saitoh | 2008-08-05 |
| 6864640 | Plasma processing method and apparatus thereof | Tomohiro Okumura, Izuru Matsuda | 2005-03-08 |
| 6830653 | Plasma processing method and apparatus | Tomohiro Okumura, Izuru Matsuda, Takayuki Kai, Mitsuo Saitoh | 2004-12-14 |
| 6707253 | Matching circuit and plasma processing apparatus | Kenji Sumida, Tomohiro Okumura, Ichiro Nakayama, Kibatsu Shinohara, Minoru Kanda +1 more | 2004-03-16 |