Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358268 | Laminating device | Ryuta Abe, Yukihiro Maegawa, Takahiro Kuhara | 2025-07-15 |
| 12359349 | Method for manufacturing carbon fiber bundle | Takuya Kataoka, Takamitsu Hirose, Yusuke Kuji | 2025-07-15 |
| 12060659 | Method of producing flame-resistant fiber bundle and carbon fiber bundle and flameproofing furnace | Kohei Takamatsu, Yusuke Kuji, Taku Yamamoto, Kazuyuki Gondo | 2024-08-13 |
| 12031244 | Oxidation heat treatment oven and method for manufacturing oxidized fiber bundle and carbon fiber bundle | Taku Yamamoto, Kazuyuki Gondo, Shigeki Chieda, Toru Nishikawa, Fumiyasu Nomura | 2024-07-09 |
| 12012671 | Method for producing flame-proof fiber bundle, and method for producing carbon fiber bundle | Taku Yamamoto, Kazuyuki Gondo, Kohei Takamatsu, Yusuke Kuji | 2024-06-18 |
| 9548477 | Battery block | Yasuhiro Asaida, Yukio Nishikawa, Hideaki Hamada, Daisuke Kishii | 2017-01-17 |
| 8835032 | Battery module | Hiroshi Takasaki, Yasuhiro Asaida, Tsuneyuki Ejima, Takuya Nakashima | 2014-09-16 |
| 7938929 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2011-05-10 |
| 7490652 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2009-02-17 |
| 7357288 | Component connecting apparatus | Kazuki Fukada, Keiichi Iwata, Daido Komyoji | 2008-04-15 |
| 7076867 | Pressurizing method | Akihiro Yamamoto, Sakae Kobayashi, Yoshikazu Yoshimura, Kenji Takahashi, Hiroshi Nasu +2 more | 2006-07-18 |
| 6995342 | Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus | Hiroshi Yamauchi, Kazuki Fukada, Katsuhiko Watanabe | 2006-02-07 |
| 6839959 | Component mounting apparatus | Youichi Nakamura, Wataru Hirai, Kunio Sakurai | 2005-01-11 |
| 6797926 | Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus | Hiroshi Yamauchi, Kazuki Fukada, Katsuhiko Watanabe | 2004-09-28 |
| 6561408 | Bonding head and component mounting apparatus | Shuji Ono, Hidenobu Nishikawa, Mitsuo Maeno, Hiroshi Nasu | 2003-05-13 |
| 6544377 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2003-04-08 |
| 6506222 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi +1 more | 2003-01-14 |
| 6264704 | Method and apparatus for mounting component | Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi +1 more | 2001-07-24 |
| 6246789 | Component mounting apparatus and method | Koichi Morita, Shunji Onobori, Shozo Minamitani, Kenichi Nishino | 2001-06-12 |