HN

Hidenobu Nishikawa

PA Panasonic: 14 patents #1,670 of 21,108Top 8%
Sumitomo Electric Industries: 6 patents #4,612 of 21,551Top 25%
Overall (All Time): #224,553 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
8866021 Circuit board and process for producing the same Daido Komyoji 2014-10-21
8599571 Memory card Daido Komyoji, Atsunobu Iwamoto, Hiroyuki Yamada, Shuichi Takeda, Shigeru Kondou 2013-12-03
8291582 Circuit board and process for producing the same Daido Komyoji 2012-10-23
8223500 Memory card and method for manufacturing the same Yuichiro Yamada, Hiroyuki Yamada, Shuichi Takeda 2012-07-17
8125786 Memory card Daido Komyoji, Hiroyuki Yamada, Yutaka Nakamura, Shuichi Takeda, Yasuharu Kikuchi 2012-02-28
8035225 Semiconductor chip assembly and fabrication method therefor Kojiro Nakamura, Kentaro Kumazawa 2011-10-11
8031127 Semiconductor memory module incorporating antenna Shozo Ochi, Hiroshi Sakurai 2011-10-04
8007627 Electronic component mounting method and apparatus Kazuto Nishida, Yoshinori Wada, Hiroyuki Otani 2011-08-30
7939923 Memory card and method for manufacturing memory card Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto 2011-05-10
7933127 Memory card and memory card manufacturing method Hiroyuki Yamada, Shuichi Takeda, Atsunobu Iwamoto 2011-04-26
7910406 Electronic circuit device and method for manufacturing same Kentaro Kumazawa, Shigeru Kondou 2011-03-22
7775446 Card type information device and method for manufacturing same Shozo Ochi, Osamu Uchida, Shigeaki Sakatani, Daisuke Sakurai, Masato Mori +1 more 2010-08-17
7683482 Electronic component unit Kazuto Nishida, Yoshinori Wada, Hiroyuki Otani 2010-03-23
7471260 Semiconductor memory module having built-in antenna Shozo Ochi, Norihito Tsukahara, Kazuhiro Ikurumi, Masato Hirano 2008-12-30
7355126 Electronic parts packaging method and electronic parts package Kazuto Nishida, Kazumichi Shimizu, Shuji Ono, Hiroyuki Otani 2008-04-08
7076867 Pressurizing method Akihiro Yamamoto, Sakae Kobayashi, Yoshikazu Yoshimura, Naoto Hosotani, Kenji Takahashi +2 more 2006-07-18
7060528 Method for mounting a semiconductor element to an interposer by compression bonding Kazuto Nishida, Kazumichi Shimizu, Hiroyuki Otani 2006-06-13
6926796 Electronic parts mounting method and device therefor Kazuto Nishida, Yoshinori Wada, Hiroyuki Otani 2005-08-09
6770320 Apparatus and method for applying fluid Hiroshi Yamauchi, Takashi Sonoda, Teruo Maruyama, Shuji Ono 2004-08-03
6561408 Bonding head and component mounting apparatus Naoto Hosotani, Shuji Ono, Mitsuo Maeno, Hiroshi Nasu 2003-05-13