Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8007627 | Electronic component mounting method and apparatus | Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani | 2011-08-30 |
| 7960828 | Carrier frame for electronic components and production method for electronic components | Toshihiko Satou, Kazuhiko Takahashi, Satoru Waga | 2011-06-14 |
| 7771561 | Apparatus and method for surface treatment to substrate | Naoki Suzuki, Kazuyuki Tomita | 2010-08-10 |
| 7759784 | 3D circuit module, multilayer 3D circuit module formed thereof, mobile terminal device using the circuit modules and method for manufacturing the circuit modules | Masahiro Ono, Shigeru Kondou, Kazuhiro Nishikawa | 2010-07-20 |
| 7683482 | Electronic component unit | Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani | 2010-03-23 |
| 7613010 | Stereoscopic electronic circuit device, and relay board and relay frame used therein | Masahiro Ono, Shigeru Kondo, Kazuhiro Nishikawa, Yoshihiko Yagi | 2009-11-03 |
| 7473476 | Soldering method, component to be joined by the soldering method, and joining structure | Atsushi Yamaguchi, Masato Hirano | 2009-01-06 |
| 7355126 | Electronic parts packaging method and electronic parts package | Hidenobu Nishikawa, Kazumichi Shimizu, Shuji Ono, Hiroyuki Otani | 2008-04-08 |
| 7090502 | Board connecting component and three-dimensional connecting structure using thereof | Masahiro Ono, Shigeru Kondou, Kazuhiro Nishikawa, Hiroyuki Inoue, Osamu Miyazaki +2 more | 2006-08-15 |
| 7060528 | Method for mounting a semiconductor element to an interposer by compression bonding | Hidenobu Nishikawa, Kazumichi Shimizu, Hiroyuki Otani | 2006-06-13 |
| 6981317 | Method and device for mounting electronic component on circuit board | — | 2006-01-03 |
| 6966964 | Method and apparatus for manufacturing semiconductor device | Koujiro Nakamura, Yoshihiko Yagi, Michiro Yoshino | 2005-11-22 |
| 6926796 | Electronic parts mounting method and device therefor | Hidenobu Nishikawa, Yoshinori Wada, Hiroyuki Otani | 2005-08-09 |
| 6156150 | IC component separating method and separating apparatus | — | 2000-12-05 |
| 6086441 | Method for connecting electrodes of plasma display panel | Takashi Akiguchi | 2000-07-11 |
| 5917156 | Circuit board having electrodes and pre-deposit solder receiver | Kazuhiro Nobori, Norihito Tsukahara | 1999-06-29 |
| 5858806 | Method of bonding IC component to flat panel display | — | 1999-01-12 |
| 5462626 | Method of bonding an external lead and a tool therefor | Shinji Kanayama, Akira Kabeshita, Kenichi Nishino, Satoshi Ohnakada, Takahiko Murata +1 more | 1995-10-31 |
| 5240170 | Method for bonding lead of IC component with electrode | Kazuhiro Nobori, Yoshifumi Kitayama, Keiji Saeki | 1993-08-31 |