Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7090482 | Semiconductor device package manufacturing method and semiconductor device package manufactured by the method | Norihito Tsukahara, Hidenori Miyakawa | 2006-08-15 |
| 6780668 | Package of semiconductor device and method of manufacture thereof | Norihito Tsukahara, Hidenori Miyakawa | 2004-08-24 |
| 6708401 | Method of manufacturing article having electronic circuit | Hidenori Miyakawa, Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Yoshinori Wada +1 more | 2004-03-23 |
| 6357106 | Method for mounting parts and making an IC card | Mitsumasa Oku, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura +1 more | 2002-03-19 |
| 6086441 | Method for connecting electrodes of plasma display panel | Kazuto Nishida | 2000-07-11 |
| 5744382 | Method of packaging electronic chip component and method of bonding of electrode thereof | Yoshifumi Kitayama, Kazuhiro Mori, Keiji Saeki | 1998-04-28 |
| 5646439 | Electronic chip component with passivation film and organic protective film | Yoshifumi Kitayama, Kazuhiro Mori, Keiji Saeki | 1997-07-08 |
| 5427642 | Method for mounting electronic parts on a printed circuit board by use of an adhesive composition | Yukio Maeda | 1995-06-27 |
| 5137936 | Method for packaging electronic parts and adhesive for use in said method | Yukio Maeda, Daisuke Irii | 1992-08-11 |