Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11293583 | Heat-insulation material, heat-insulation structure using same, and process for producing same | DAIDO KOHMYOHJI, Kazuma Oikawa, Takashi Tsuruta, Tooru Wada, Shigeaki Sakatani | 2022-04-05 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki | 2019-09-10 |
| 9072204 | Electronic module and production method therefor | Ryo Kuwabara, Atsushi Yamaguchi, Masahiro Ono | 2015-06-30 |
| 8697237 | Thermosetting resin composition, method of manufacturing the same and circuit board | HIROHISA HINO, Taro Fukui, Atsushi Yamaguchi, Takayuki Higuchi | 2014-04-15 |
| 8679635 | Bonding material, bonded portion and circuit board | Atsushi Yamaguchi, Kazuhiro Nishikawa | 2014-03-25 |
| 8540903 | Electrically conductive paste, and electrical and electronic device comprising the same | Takayuki Higuchi, Atsushi Yamaguchi, Arata Kishi, Naomichi Ohashi | 2013-09-24 |
| 8481629 | Surface mount adhesive, mounting structure including the same, and method for producing mounting structure | Ryo Kuwabara, Atsushi Yamaguchi | 2013-07-09 |
| 8482931 | Package structure | Ryo Kuwabara, Koso Matsuno, Atsushi Yamaguchi | 2013-07-09 |
| 8450859 | Semiconductor device mounted structure and its manufacturing method | Naomichi Ohashi, Shigeaki Sakatani, Arata Kishi, Atsushi Yamaguchi | 2013-05-28 |
| 8410377 | Mounted structure | Atsushi Yamaguchi, Shigeaki Sakatani, Koso Matsuno | 2013-04-02 |
| 8378472 | Mounting structure for semiconductor element with underfill resin | Koso Matsuno, Atsushi Yamaguchi, Shigeaki Sakatani, Mikiya Ueda | 2013-02-19 |
| 8345444 | Structure with electronic component mounted therein and method for manufacturing such structure | Shigeaki Sakatani, Koso Matsuno, Atsushi Yamaguchi, Mikiya Ueda | 2013-01-01 |
| 8344268 | Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same | Hideyuki Tsujimura, Atsushi Yamaguchi, Hiroe Kowada, Koso Matsuno | 2013-01-01 |
| 8293370 | Bonding material, bonded portion and circuit board | Atsushi Yamaguchi, Kazuhiro Nishikawa | 2012-10-23 |
| 8217275 | Sealing material and mounting method using the sealing material | Atsushi Yamaguchi, Kousou Matsuno | 2012-07-10 |
| 8205327 | Method for manufacturing circuit board on which electronic component is mounted | Atsushi Yamaguchi, Kazuhiro Nishikawa, Kunio Hibino | 2012-06-26 |
| 8182923 | Conductive paste and mounting structure using the same | Naomichi Ohashi, Atsushi Yamaguchi, Arata Kishi, Takayuki Higuchi | 2012-05-22 |
| 8179686 | Mounted structural body and method of manufacturing the same | Shigeaki Sakatani, Atsushi Yamaguchi, Koso Matsuno | 2012-05-15 |
| 8138426 | Mounting structure | Koso Matsuno, Shigeaki Sakatani | 2012-03-20 |
| 8012379 | Electroconductive bonding material and electric/electronic device using the same | Shigeaki Sakatani, Kumiko Sugiyama, Takayuki Higuchi, Atsushi Yamaguchi | 2011-09-06 |
| 7935892 | Electronic circuit device and method for manufacturing same | Kazuhiro Nishikawa, Norihito Tsukahara, Shigeaki Sakatani | 2011-05-03 |
| 7785500 | Electrically conductive adhesive | Atsushi Yamaguchi, Takayuki Higuchi, Koso Matsuno, Hideyuki Tsujimura | 2010-08-31 |
| 7090482 | Semiconductor device package manufacturing method and semiconductor device package manufactured by the method | Norihito Tsukahara, Takashi Akiguchi | 2006-08-15 |
| 6780668 | Package of semiconductor device and method of manufacture thereof | Norihito Tsukahara, Takashi Akiguchi | 2004-08-24 |
| 6708401 | Method of manufacturing article having electronic circuit | Yoshio Maruyama, Hiroshi Yamauchi, Mikiya Nakata, Takashi Akiguchi, Yoshinori Wada +1 more | 2004-03-23 |