Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028986 | Mounting method and mounting structure formed by the same | Yasuhiro OKAWA, Koso Matsuno | 2024-07-02 |
| 11970631 | Conductive paste and conductive film formed using the same | Koso Matsuno | 2024-04-30 |
| 11618110 | Solder paste and mounting structure | Koso Matsuno, Yasuhiro OKAWA | 2023-04-04 |
| 10440834 | Resin fluxed solder paste, and mount structure | HIROHISA HINO, Yuki YOSHIOKA, Masato Mori, Yasuhiro Suzuki | 2019-10-08 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Arata Kishi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |
| 9881813 | Mounting structure and method for producing mounting structure | HIROHISA HINO, Yasuhiro Suzuki, Masato Mori | 2018-01-30 |
| 9603295 | Mounted structure and manufacturing method of mounted structure | Atsushi Yamaguchi, Hisahiko Yoshida, Arata Kishi | 2017-03-21 |
| 9331047 | Mounting method and mounting structure for semiconductor package component | Atsushi Yamaguchi, Arata Kishi, Masato Udaka, Seiji Tokii | 2016-05-03 |
| 8940198 | Conductive adhesive, and circuit board and electronic component module using the same | Arata Kishi, Atsushi Yamaguchi | 2015-01-27 |
| 8664773 | Mounting structure of semiconductor package component and manufacturing method therefor | Atsushi Yamaguchi, Hideyuki Tsujimura, Hiroe Kowada, Ryo Kuwabara | 2014-03-04 |
| 8540903 | Electrically conductive paste, and electrical and electronic device comprising the same | Takayuki Higuchi, Hidenori Miyakawa, Atsushi Yamaguchi, Arata Kishi | 2013-09-24 |
| 8450859 | Semiconductor device mounted structure and its manufacturing method | Shigeaki Sakatani, Arata Kishi, Atsushi Yamaguchi, Hidenori Miyakawa | 2013-05-28 |
| 8182923 | Conductive paste and mounting structure using the same | Hidenori Miyakawa, Atsushi Yamaguchi, Arata Kishi, Takayuki Higuchi | 2012-05-22 |