Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11028262 | Resin composition, anisotropic conductive film including the same, and electronic device | Yuki YOSHIOKA | 2021-06-08 |
| 10464153 | Connecting method of circuit member | Hiroki Maruo | 2019-11-05 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |
| 10412838 | Conductive particle, and connection material, connection structure, and connecting method of circuit member | Hiroki Maruo | 2019-09-10 |
| 10412834 | Mounting structure and method for manufacturing same | Hironori Munakata, Koji Motomura, Hiroki Maruo | 2019-09-10 |
| 10037960 | Connection structure and connecting method of circuit member | Hiroki Maruo | 2018-07-31 |
| 9999123 | Connection structure of circuit member, connection method, and connection material | Tadashi Maeda, Tadahiko Sakai | 2018-06-12 |
| 9795036 | Mounting structure and method for manufacturing same | Hironori Munakata, Koji Motomura, Hiroki Maruo | 2017-10-17 |
| 9603295 | Mounted structure and manufacturing method of mounted structure | Atsushi Yamaguchi, Hisahiko Yoshida, Naomichi Ohashi | 2017-03-21 |
| 9331047 | Mounting method and mounting structure for semiconductor package component | Naomichi Ohashi, Atsushi Yamaguchi, Masato Udaka, Seiji Tokii | 2016-05-03 |
| 9322541 | Cooling structure | HIROHISA HINO, HONAMI NAWA | 2016-04-26 |
| 9237686 | Method and system for producing component mounting board | Koji Motomura, Hiroki Maruo, Yasuhiro Suzuki, Hironori Munakata | 2016-01-12 |
| 8940198 | Conductive adhesive, and circuit board and electronic component module using the same | Naomichi Ohashi, Atsushi Yamaguchi | 2015-01-27 |
| 8540903 | Electrically conductive paste, and electrical and electronic device comprising the same | Takayuki Higuchi, Hidenori Miyakawa, Atsushi Yamaguchi, Naomichi Ohashi | 2013-09-24 |
| 8450859 | Semiconductor device mounted structure and its manufacturing method | Naomichi Ohashi, Shigeaki Sakatani, Atsushi Yamaguchi, Hidenori Miyakawa | 2013-05-28 |
| 8182923 | Conductive paste and mounting structure using the same | Naomichi Ohashi, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi | 2012-05-22 |
| 8132707 | Flow soldering apparatus and flow soldering method using a water content sensor | Kimiaki Nakaya, Kenichiro Suetsugu | 2012-03-13 |
| 7780057 | Soldering apparatus and soldering method | Kimiaki Nakaya, Kenichiro Suetsugu | 2010-08-24 |