Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10786876 | Mounting Method of a semiconductor device using a colored auxiliary joining agent | Teppei Kojio, Hiroki Maruo | 2020-09-29 |
| 10464286 | Laminated nonwoven fabric and manufacturing method thereof | Taichi Nakamura, Takayoshi Yamaguchi | 2019-11-05 |
| 10464003 | Filter | Hiroto Sumida, Takahiko Murata, Takatoshi Mitsushima, Keiji Fujiwara | 2019-11-05 |
| 10464285 | Laminate and manufacturing method thereof | Kouji Ikeda, Takatoshi Mitsushima | 2019-11-05 |
| 10413856 | Stacked body | Hiroto Sumida, Takahiko Murata | 2019-09-17 |
| 10412834 | Mounting structure and method for manufacturing same | Arata Kishi, Hironori Munakata, Hiroki Maruo | 2019-09-10 |
| 10232293 | Fiber laminate and manufacturing method thereof | Nobuhiro Nishizaki, Kouji Ikeda, Takahiko Murata, Takatoshi Mitsushima | 2019-03-19 |
| 10220340 | Laminated nonwoven fabric and air purifier | Takahiko Murata, Hiroto Sumida, Takahiro Kurokawa, Takatoshi Mitsushima | 2019-03-05 |
| 10195556 | Laminated nonwoven fabric and air purifier | Takahiko Murata, Hiroto Sumida, Takatoshi Mitsushima, Keiji Fujiwara | 2019-02-05 |
| 10173158 | Laminated nonwoven fabric, air purifier, and manufacturing method of laminated nonwoven fabric | Hiroto Sumida, Takahiro Kurokawa, Taichi Nakamura, Takayoshi Yamaguchi, Takatoshi Mitsushima | 2019-01-08 |
| 10080298 | Circuit board interconnection structure and circuit board interconnection method | Hideki Eifuku | 2018-09-18 |
| 9902880 | Film material, electronic component using film material, and method for producing electronic component | — | 2018-02-27 |
| 9839143 | Electrode joining method, production method of electrode joined structure | Hideki Eifuku, Hiroki Maruo, Tadahiko Sakai | 2017-12-05 |
| 9795036 | Mounting structure and method for manufacturing same | Arata Kishi, Hironori Munakata, Hiroki Maruo | 2017-10-17 |
| 9756728 | Component-mounted structure | Tadahiko Sakai, Hideki Eifuku | 2017-09-05 |
| 9609760 | Electronic component mounting method | Tsubasa Saeki, Yoshiyuki Wada, Tadahiko Sakai | 2017-03-28 |
| 9516749 | Electronic component-mounted structure, IC card and COF package | Yoshiyuki Wada, Tadahiko Sakai | 2016-12-06 |
| 9237686 | Method and system for producing component mounting board | Arata Kishi, Hiroki Maruo, Yasuhiro Suzuki, Hironori Munakata | 2016-01-12 |
| 8851138 | Substrate backing device and substrate thermocompression-bonding device | Hiroki Maruo, Hideki Eifuku, Tadahiko Sakai | 2014-10-07 |
| 8817487 | Electronic component mounting system and electronic component mounting method | Hideki Eifuku, Tadahiko Sakai | 2014-08-26 |
| 8686299 | Electronic element unit and reinforcing adhesive agent | Seiichi Yoshinaga, Tadahiko Sakai | 2014-04-01 |
| 8434665 | Electronic component mounting system and electronic component mounting method | Hideki Eifuku, Tadahiko Sakai | 2013-05-07 |
| 7845074 | Method for manufacturing electronic parts module | Hideki Eifuku, Tadahiko Sakai | 2010-12-07 |
| 7841081 | Method for manufacturing electronic parts module | Hideki Eifuku, Tadahiko Sakai | 2010-11-30 |