| 10080298 |
Circuit board interconnection structure and circuit board interconnection method |
Koji Motomura |
2018-09-18 |
| 10034389 |
Electric component mounting method |
— |
2018-07-24 |
| 9949380 |
Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component |
Wanyu TIE, Hironori Munakata |
2018-04-17 |
| 9839143 |
Electrode joining method, production method of electrode joined structure |
Koji Motomura, Hiroki Maruo, Tadahiko Sakai |
2017-12-05 |
| 9756728 |
Component-mounted structure |
Tadahiko Sakai, Koji Motomura |
2017-09-05 |
| 9015932 |
Connecting method of electronic component |
Tadahiko Sakai |
2015-04-28 |
| 8851138 |
Substrate backing device and substrate thermocompression-bonding device |
Hiroki Maruo, Koji Motomura, Tadahiko Sakai |
2014-10-07 |
| 8817487 |
Electronic component mounting system and electronic component mounting method |
Koji Motomura, Tadahiko Sakai |
2014-08-26 |
| 8434665 |
Electronic component mounting system and electronic component mounting method |
Koji Motomura, Tadahiko Sakai |
2013-05-07 |
| 8188605 |
Components joining method and components joining structure |
Tadahiko Sakai, Yoshiyuki Wada |
2012-05-29 |
| 8148253 |
Electronic component soldering structure and electronic component soldering method |
Mitsuru Ozono, Tadahiko Sakai |
2012-04-03 |
| 8034447 |
Electronic components mounting adhesive and electronic components mounting structure |
Tadahiko Sakai, Kouji Motomura |
2011-10-11 |
| 8025205 |
Electronic component mounting method |
Tadahiko Sakai, Osamu Suzuki, Satomi Kawamoto |
2011-09-27 |
| 8018074 |
Components joining method and components joining structure |
Tadahiko Sakai, Yoshiyuki Wada |
2011-09-13 |
| 7886432 |
Electric components connecting method |
Tadahiko Sakai |
2011-02-15 |
| 7845074 |
Method for manufacturing electronic parts module |
Koji Motomura, Tadahiko Sakai |
2010-12-07 |
| 7841081 |
Method for manufacturing electronic parts module |
Koji Motomura, Tadahiko Sakai |
2010-11-30 |
| 7797822 |
Electronic component mounting method |
Tadahiko Sakai, Teruaki Nishinaka |
2010-09-21 |
| 7793413 |
Method of mounting electronic components |
Tadahiko Sakai |
2010-09-14 |
| 6209196 |
Method of mounting bumped electronic components |
Mitsuru Ozono, Tadahiko Sakai |
2001-04-03 |
| 6179198 |
Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps |
Mitsuru Ozono, Tadahiko Sakai, Shoji Sakemi |
2001-01-30 |
| 6000127 |
Electronic parts mounting method |
Tadahiko Sakai |
1999-12-14 |
| 5962925 |
Mounting structure of electronic component having bumps |
Tadahiko Sakai |
1999-10-05 |
| 5749510 |
Semiconductor chip bonding method |
— |
1998-05-12 |
