Hideki Eifuku — 24 Patents at Panasonic

Hideki Eifuku has been granted 24 US patents while listed as an inventor at Panasonic. The first was granted in 1998 and the most recent in September 2018. Hideki Eifuku ranks #168,038 of 4,157,543 US inventors in our database (top 4.0%). Patent records list Hideki Eifuku in Osaka, JP.

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Showing 1–24 of 24 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10080298	Circuit board interconnection structure and circuit board interconnection method	Koji Motomura	2018-09-18
10034389	Electric component mounting method	—	2018-07-24
9949380	Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component	Wanyu TIE, Hironori Munakata	2018-04-17
9839143	Electrode joining method, production method of electrode joined structure	Koji Motomura, Hiroki Maruo, Tadahiko Sakai	2017-12-05
9756728	Component-mounted structure	Tadahiko Sakai, Koji Motomura	2017-09-05
9015932	Connecting method of electronic component	Tadahiko Sakai	2015-04-28
8851138	Substrate backing device and substrate thermocompression-bonding device	Hiroki Maruo, Koji Motomura, Tadahiko Sakai	2014-10-07
8817487	Electronic component mounting system and electronic component mounting method	Koji Motomura, Tadahiko Sakai	2014-08-26
8434665	Electronic component mounting system and electronic component mounting method	Koji Motomura, Tadahiko Sakai	2013-05-07
8188605	Components joining method and components joining structure	Tadahiko Sakai, Yoshiyuki Wada	2012-05-29	$54,000
8148253	Electronic component soldering structure and electronic component soldering method	Mitsuru Ozono, Tadahiko Sakai	2012-04-03	$58,000
8034447	Electronic components mounting adhesive and electronic components mounting structure	Tadahiko Sakai, Kouji Motomura	2011-10-11	$64,000
8025205	Electronic component mounting method	Tadahiko Sakai, Osamu Suzuki, Satomi Kawamoto	2011-09-27	$106,000
8018074	Components joining method and components joining structure	Tadahiko Sakai, Yoshiyuki Wada	2011-09-13	$51,000
7886432	Electric components connecting method	Tadahiko Sakai	2011-02-15	$109,000
7845074	Method for manufacturing electronic parts module	Koji Motomura, Tadahiko Sakai	2010-12-07	$81,000
7841081	Method for manufacturing electronic parts module	Koji Motomura, Tadahiko Sakai	2010-11-30	$134,000
7797822	Electronic component mounting method	Tadahiko Sakai, Teruaki Nishinaka	2010-09-21	$94,000
7793413	Method of mounting electronic components	Tadahiko Sakai	2010-09-14	$88,000
6209196	Method of mounting bumped electronic components	Mitsuru Ozono, Tadahiko Sakai	2001-04-03	$144,000
6179198	Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps	Mitsuru Ozono, Tadahiko Sakai, Shoji Sakemi	2001-01-30	$157,000
6000127	Electronic parts mounting method	Tadahiko Sakai	1999-12-14	$453,000
5962925	Mounting structure of electronic component having bumps	Tadahiko Sakai	1999-10-05	$292,000
5749510	Semiconductor chip bonding method	—	1998-05-12	$97,000

Hideki Eifuku — 24 Patents

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