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USPTO Patent Rankings Data through Dec 31, 2025
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Hideki Eifuku — 24 Patents

Panasonic: 19 patents #1,087 of 21,108Top 6%
Sumitomo Electric Industries: 5 patents #5,365 of 21,551Top 25%
NANamics: 1 patents #52 of 113Top 50%
Osaka, JP: #1,694 of 24,344 inventorsTop 7%
Overall (All Time): #168,038 of 4,157,543Top 5%
24 Patents All Time
Hideki Eifuku has been granted 24 US patents while listed as an inventor at Panasonic. The first was granted in 1998 and the most recent in September 2018. Hideki Eifuku ranks #168,038 of 4,157,543 US inventors in our database (top 4.0%). Patent records list Hideki Eifuku in Osaka, JP.

Patents per Year

Patents granted per year, 1998 to 2018Bar chart with a peak of 4 patents in 2010.peak 41998: 1 patents19981999: 2 patents2001: 2 patents20012010: 4 patents2011: 4 patents20112012: 2 patents2013: 1 patents20132014: 2 patents2015: 1 patents20152017: 2 patents2018: 3 patents2018

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10080298 Circuit board interconnection structure and circuit board interconnection method Koji Motomura 2018-09-18
10034389 Electric component mounting method — 2018-07-24
9949380 Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component Wanyu TIE, Hironori Munakata 2018-04-17
9839143 Electrode joining method, production method of electrode joined structure Koji Motomura, Hiroki Maruo, Tadahiko Sakai 2017-12-05
9756728 Component-mounted structure Tadahiko Sakai, Koji Motomura 2017-09-05
9015932 Connecting method of electronic component Tadahiko Sakai 2015-04-28
8851138 Substrate backing device and substrate thermocompression-bonding device Hiroki Maruo, Koji Motomura, Tadahiko Sakai 2014-10-07
8817487 Electronic component mounting system and electronic component mounting method Koji Motomura, Tadahiko Sakai 2014-08-26
8434665 Electronic component mounting system and electronic component mounting method Koji Motomura, Tadahiko Sakai 2013-05-07
8188605 Components joining method and components joining structure Tadahiko Sakai, Yoshiyuki Wada 2012-05-29 $54,000
8148253 Electronic component soldering structure and electronic component soldering method Mitsuru Ozono, Tadahiko Sakai 2012-04-03 $58,000
8034447 Electronic components mounting adhesive and electronic components mounting structure Tadahiko Sakai, Kouji Motomura 2011-10-11 $64,000
8025205 Electronic component mounting method Tadahiko Sakai, Osamu Suzuki, Satomi Kawamoto 2011-09-27 $106,000
8018074 Components joining method and components joining structure Tadahiko Sakai, Yoshiyuki Wada 2011-09-13 $51,000
7886432 Electric components connecting method Tadahiko Sakai 2011-02-15 $109,000
7845074 Method for manufacturing electronic parts module Koji Motomura, Tadahiko Sakai 2010-12-07 $81,000
7841081 Method for manufacturing electronic parts module Koji Motomura, Tadahiko Sakai 2010-11-30 $134,000
7797822 Electronic component mounting method Tadahiko Sakai, Teruaki Nishinaka 2010-09-21 $94,000
7793413 Method of mounting electronic components Tadahiko Sakai 2010-09-14 $88,000
6209196 Method of mounting bumped electronic components Mitsuru Ozono, Tadahiko Sakai 2001-04-03 $144,000
6179198 Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps Mitsuru Ozono, Tadahiko Sakai, Shoji Sakemi 2001-01-30 $157,000
6000127 Electronic parts mounting method Tadahiko Sakai 1999-12-14 $453,000
5962925 Mounting structure of electronic component having bumps Tadahiko Sakai 1999-10-05 $292,000
5749510 Semiconductor chip bonding method — 1998-05-12 $97,000

Frequent Collaborators

Tadahiko Sakai20 shared
Koji Motomura8 shared
Mitsuru Ozono3 shared
Hiroki Maruo2 shared
Yoshiyuki Wada2 shared
Teruaki Nishinaka1 shared

Nearby-Ranked Inventors

Tracy Helen Fung24
Yang Li24
Bo Ching Jiang24
Shoham DEKEL24
David B. Coulter24
Akiko WATANO24
Walter Nistico24
Thomas W. Chalberg, Jr.24
Alan R. Dombrowski24