Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12247827 | Bead appearance inspection device, bead appearance inspection method, program, and bead appearance inspection system | Katsuaki OKUMA, Kazuyuki Nakashima | 2025-03-11 |
| 9439336 | Component mounting system | Takahiro Yokomae, Nobuya Matsuo | 2016-09-06 |
| 9332681 | Electronic component mounting system | Masayuki Mantani | 2016-05-03 |
| 8293652 | Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method | Kiyoshi Arita | 2012-10-23 |
| 7989803 | Manufacturing method for semiconductor chips and semiconductor wafer | Kiyoshi Arita | 2011-08-02 |
| 7797822 | Electronic component mounting method | Tadahiko Sakai, Hideki Eifuku | 2010-09-21 |
| 7629228 | Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks | Hiroshi Haji, Kiyoshi Arita | 2009-12-08 |
| 7488668 | Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions | Kiyoshi Arita, Hiroshi Haji, Kazuhiro Noda, Akira Nakagawa | 2009-02-10 |
| 7107672 | Method of mounting electronic parts on a flexible printed circuit board | Yasuto Onitsuka | 2006-09-19 |
| 6013899 | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component | Shigeru Eguchi | 2000-01-11 |
| 5894984 | Structure of electronic parts and method of soldering electronic parts to substrate | Tadahiko Sakai, Shoji Sakemi | 1999-04-20 |
| 5779958 | Method for packaging electronic device | Syoujirou Nishihara | 1998-07-14 |
| 5695667 | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component | Shigeru Eguchi | 1997-12-09 |
| 5655704 | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component | Shoji Sakemi | 1997-08-12 |
| 5548891 | Method of automatically mounting electronic connector onto an end of printed circuit board | Shoji Sakemi | 1996-08-27 |