Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10069042 | Light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting system | Toshihide Maeda | 2018-09-04 |
| 9775301 | Cultivation system | Ryuji Nagadome | 2017-10-03 |
| 9433158 | Plant cultivation system | Ryuji Nagadome | 2016-09-06 |
| 8614118 | Component bonding method, component laminating method and bonded component structure | Mitsuru Ozono, Teruaki Kasai, Masaru Nonomura | 2013-12-24 |
| 8558460 | Plasma processing apparatus | Masaru Nonomura, Kiyoshi Arita | 2013-10-15 |
| 8450933 | Plasma processing apparatus | Masaru Nonomura, Kiyoshi Arita | 2013-05-28 |
| 8288284 | Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method | Kiyoshi Arita | 2012-10-16 |
| 8192578 | Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method | Mitsuru Ozono, Teruaki Kasai, Kazuhiro Noda | 2012-06-05 |
| 8158494 | Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer | Kiyoshi Arita | 2012-04-17 |
| 7964449 | Method for manufacturing semiconductor chip and method for processing semiconductor wafer | Kiyoshi Arita | 2011-06-21 |
| 7927973 | Method for dividing semiconductor wafer and manufacturing method for semiconductor devices | Kiyoshi Arita, Akira Nakagawa, Kazuhiro Noda | 2011-04-19 |
| 7797820 | Component mounting apparatus | Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao +4 more | 2010-09-21 |
| 7767551 | Method for fabricating semiconductor chip | Kiyoshi Arita | 2010-08-03 |
| 7629228 | Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks | Kiyoshi Arita, Teruaki Nishinaka | 2009-12-08 |
| 7488668 | Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions | Kiyoshi Arita, Kazuhiro Noda, Akira Nakagawa, Teruaki Nishinaka | 2009-02-10 |
| 7409761 | Electronic component mounting apparatus and method of mounting electronic components | Mitsuru Ozono | 2008-08-12 |
| 7353596 | Component mounting method | Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao +4 more | 2008-04-08 |
| 7243420 | Electronic component mounting method | Wataru Hidese | 2007-07-17 |
| 7222774 | Electronic component mounting apparatus and electronic component mounting method | — | 2007-05-29 |
| 7138034 | Electrode member used in a plasma treating apparatus | Kiyoshi Arita, Tetsuhiro Iwai, Shoji Sakemi, Taiji Matano, Nobuhiro Satou | 2006-11-21 |
| 7137195 | Method for mounting electronic parts onto a board | Wataru Hidese | 2006-11-21 |
| 7074720 | Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device | Kiyoshi Arita, Tetsuhiro Iwai, Shoji Sakemi | 2006-07-11 |
| 7059043 | Method for mounting an electronic part by solder position detection | Wataru Hidese, Toshiaki Nakashima | 2006-06-13 |
| 7033842 | Electronic component mounting apparatus and electronic component mounting method | Toshiro Hirakawa | 2006-04-25 |
| 7025244 | Electronic component mounting apparatus and electronic component mounting method | — | 2006-04-11 |