Issued Patents All Time
Showing 51–54 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5653380 | Wire bonding apparatus and wire bonding method | — | 1997-08-05 |
| 5647942 | Wire bonding method | — | 1997-07-15 |
| 5288008 | Method of forming inner lead bonding on a microchip | Kiyoshi Arita | 1994-02-22 |
| 5207369 | Inner lead bonding apparatus | Kiyoshi Arita | 1993-05-04 |