HH

Hiroshi Haji

Sumitomo Electric Industries: 38 patents #306 of 21,551Top 2%
PA Panasonic: 15 patents #1,528 of 21,108Top 8%
DI Disco: 1 patents #384 of 708Top 55%
KR Krosakiharima: 1 patents #47 of 126Top 40%
MC Matsushit Electric Industrial Co.: 1 patents #13 of 293Top 5%
Overall (All Time): #47,712 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 26–50 of 54 patents

Patent #TitleCo-InventorsDate
6874225 Electronic component mounting apparatus Wataru Hidese 2005-04-05
6852572 Method of manufacturing semiconductor device Shoji Sakemi, Mitsuru Ozono, Tadahiko Sakai, Kiyoshi Arita 2005-02-08
6839960 Method for mounting electronic parts on a board Wataru Hidese, Toshiaki Nakashima 2005-01-11
6792676 Apparatus and method for mounting electronic parts Wataru Hidese 2004-09-21
6784112 Method for surface treatment of silicon based substrate Kiyoshi Arita, Tetsuhiro Iwai, Shoji Sakemi 2004-08-31
D494988 Electric component placement machine Yasuhiko Tanaka, Naoyuki Kitamura, Nobuhiro Nakai, Maiko Matsuo 2004-08-24
D493808 Electric component placement machine Yosuhiko Tanaka, Naoyuki Kitamura, Nobuhiro Nakai, Maiko Matsuo 2004-08-03
6683379 Semiconductor device with reinforcing resin layer Shoji Sakemi 2004-01-27
6511895 Semiconductor wafer turning process Yutaka Koma, Kiyoshi Arita, Tetsuhiro Iwai 2003-01-28
6511917 Plasma treatment apparatus and method Kiyoshi Arita 2003-01-28
6468351 Vacuum processing apparatus with improved maintainability Kazuhiro Noda, Tetsuhiro Iwai 2002-10-22
6432751 Resin mold electric part and producing method therefor 2002-08-13
6350664 Semiconductor device and method of manufacturing the same Shoji Sakemi 2002-02-26
6340639 Plasma process apparatus and plasma process method for substrate Kiyoshi Arita, Tetsuhiro Iwai 2002-01-22
6331347 Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method 2001-12-18
6313583 Plasma processing apparatus and method Kiyoshi Arita, Isam Morisako 2001-11-06
6282780 Bump forming method and its forming apparatus. Eisuke Waki, Tsuyoshi Takata 2001-09-04
6239036 Apparatus and method for plasma etching Kiyoshi Arita 2001-05-29
6093904 Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus 2000-07-25
5972163 Plasma cleaning device for substrate 1999-10-26
5909633 Method of manufacturing an electronic component Shoji Sakemi 1999-06-01
5846875 Method of producing a semiconductor device 1998-12-08
5823416 Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus 1998-10-20
5767008 Method for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method 1998-06-16
5676856 Electric discharge apparatus for cleaning electrode on workpiece and method thereof Isamu Morisako 1997-10-14