Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9198336 | Electric component mounting system and electric component mounting method | Masahiro Kihara, Masafumi Inoue | 2015-11-24 |
| 8499688 | Screen printer | Seiichi Miyahara, Kazuhide Nagao, Yoshiaki Awata | 2013-08-06 |
| 8375852 | Screen printer | Seiichi Miyahara, Kazuhide Nagao, Yoshiaki Awata | 2013-02-19 |
| 8327761 | Screen printer | Seiichi Miyahara, Kazuhide Nagao, Yoshiaki Awata | 2012-12-11 |
| 8196287 | Electronic component installation apparatus | Yoshiaki Awata, Kazuhide Nagao, Takuya Tsutsumi | 2012-06-12 |
| 7243420 | Electronic component mounting method | Hiroshi Haji | 2007-07-17 |
| 7137195 | Method for mounting electronic parts onto a board | Hiroshi Haji | 2006-11-21 |
| 7059043 | Method for mounting an electronic part by solder position detection | Toshiaki Nakashima, Hiroshi Haji | 2006-06-13 |
| 6874225 | Electronic component mounting apparatus | Hiroshi Haji | 2005-04-05 |
| 6865803 | Component mounting method | — | 2005-03-15 |
| 6839960 | Method for mounting electronic parts on a board | Toshiaki Nakashima, Hiroshi Haji | 2005-01-11 |
| 6792676 | Apparatus and method for mounting electronic parts | Hiroshi Haji | 2004-09-21 |
| 6606790 | Component mounter and mounting method | — | 2003-08-19 |
| 6588096 | Method employing X-Y tables for simultaneously mounting electronic parts | — | 2003-07-08 |
| 6539622 | Electronic components mounting device and the mounting method | Yusuke Yamamoto | 2003-04-01 |
| 6453548 | Electronic component mounting method | — | 2002-09-24 |
| 5342460 | Outer lead bonding apparatus | — | 1994-08-30 |
| 5338381 | Apparatus and method for bonding outer leads | — | 1994-08-16 |
| 5208969 | Electronic components mounting apparatus | — | 1993-05-11 |
| 5208975 | Method and apparatus for mounting electronic parts | — | 1993-05-11 |
| 5184397 | Electrical component placing apparatus | — | 1993-02-09 |
| 5113581 | Outer lead bonding head and method of bonding outer lead | — | 1992-05-19 |
| 5033185 | Electronic component mounting apparatus | — | 1991-07-23 |