Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8614118 | Component bonding method, component laminating method and bonded component structure | Hiroshi Haji, Teruaki Kasai, Masaru Nonomura | 2013-12-24 |
| 8192578 | Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method | Hiroshi Haji, Teruaki Kasai, Kazuhiro Noda | 2012-06-05 |
| 8148253 | Electronic component soldering structure and electronic component soldering method | Tadahiko Sakai, Hideki Eifuku | 2012-04-03 |
| 7632710 | Method for soldering electronic component and soldering structure of electronic component | Tadahiko Sakai, Tadashi Maeda | 2009-12-15 |
| 7632374 | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor | Teruaki Kasai | 2009-12-15 |
| 7446423 | Semiconductor device and method for assembling the same | Tadahiko Sakai, Yoshiyuki Wada | 2008-11-04 |
| 7409761 | Electronic component mounting apparatus and method of mounting electronic components | Hiroshi Haji | 2008-08-12 |
| 6852572 | Method of manufacturing semiconductor device | Hiroshi Haji, Shoji Sakemi, Tadahiko Sakai, Kiyoshi Arita | 2005-02-08 |
| 6808086 | Paste ejection apparatus | Shinji Sasaguri | 2004-10-26 |
| 6797544 | Semiconductor device, method of manufacturing the device and method of mounting the device | Tadahiko Sakai, Tadashi Maeda | 2004-09-28 |
| 6685777 | Paste applicator and paste application method for die bonding | Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji | 2004-02-03 |
| 6617675 | Semiconductor device and semiconductor device assembly | Tadahiko Sakai, Shoji Sakemi, Yoshiyuki Wada | 2003-09-09 |
| 6605315 | Bonding paste applicator and method of using it | Seiichi Sato, Nobuyuki Suefuji, Nobuyuki Iwashita | 2003-08-12 |
| 6460756 | Method of applying bonding paste | Seiichi Sato, Nobuyuki Suefuji | 2002-10-08 |
| 6361831 | Paste application method for die bonding | Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Nobuyuki Suefuji | 2002-03-26 |
| 6348234 | Paste applying method | Hitoshi Mukojima, Seiichi Sato, Nobuyuki Iwashita, Nobuyuki Suefuji | 2002-02-19 |
| 6209196 | Method of mounting bumped electronic components | Hideki Eifuku, Tadahiko Sakai | 2001-04-03 |
| 6179198 | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Hideki Eifuku, Tadahiko Sakai, Shoji Sakemi | 2001-01-30 |