Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6685777 | Paste applicator and paste application method for die bonding | Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Mitsuru Ozono | 2004-02-03 |
| 6605315 | Bonding paste applicator and method of using it | Mitsuru Ozono, Seiichi Sato, Nobuyuki Iwashita | 2003-08-12 |
| 6460756 | Method of applying bonding paste | Mitsuru Ozono, Seiichi Sato | 2002-10-08 |
| 6361831 | Paste application method for die bonding | Seiichi Sato, Hitoshi Mukojima, Nobuyuki Iwashita, Mitsuru Ozono | 2002-03-26 |
| 6348234 | Paste applying method | Mitsuru Ozono, Hitoshi Mukojima, Seiichi Sato, Nobuyuki Iwashita | 2002-02-19 |