Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8557630 | Electronic component mounting method and electronic component mount structure | — | 2013-10-15 |
| 7138034 | Electrode member used in a plasma treating apparatus | Kiyoshi Arita, Tetsuhiro Iwai, Hiroshi Haji, Taiji Matano, Nobuhiro Satou | 2006-11-21 |
| 7074720 | Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device | Kiyoshi Arita, Tetsuhiro Iwai, Hiroshi Haji | 2006-07-11 |
| 6852572 | Method of manufacturing semiconductor device | Hiroshi Haji, Mitsuru Ozono, Tadahiko Sakai, Kiyoshi Arita | 2005-02-08 |
| 6784112 | Method for surface treatment of silicon based substrate | Kiyoshi Arita, Tetsuhiro Iwai, Hiroshi Haji | 2004-08-31 |
| 6723651 | Plasma processing method | Kiyoshi Arita, Tetsuhiro Iwai | 2004-04-20 |
| 6683379 | Semiconductor device with reinforcing resin layer | Hiroshi Haji | 2004-01-27 |
| 6617675 | Semiconductor device and semiconductor device assembly | Tadahiko Sakai, Mitsuru Ozono, Yoshiyuki Wada | 2003-09-09 |
| 6536105 | Method for mounting conductive balls on a substrate | Tadahiko Sakai, Kazuhiro Noda | 2003-03-25 |
| 6468582 | Method of solder pre-coating and solder pre-coated circuit board | — | 2002-10-22 |
| 6350664 | Semiconductor device and method of manufacturing the same | Hiroshi Haji | 2002-02-26 |
| 6179198 | Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps | Hideki Eifuku, Mitsuru Ozono, Tadahiko Sakai | 2001-01-30 |
| 6109509 | Method of securely mounting conductive balls | Tadahiko Sakai | 2000-08-29 |
| 5983490 | Conductive ball mounting apparatus | — | 1999-11-16 |
| 5909633 | Method of manufacturing an electronic component | Hiroshi Haji | 1999-06-01 |
| 5894984 | Structure of electronic parts and method of soldering electronic parts to substrate | Tadahiko Sakai, Teruaki Nishinaka | 1999-04-20 |
| 5890283 | Apparatus and method for mounting electrically conductive balls | Tadahiko Sakai | 1999-04-06 |
| 5817542 | Method for bonding electronic components | — | 1998-10-06 |
| 5802712 | Electronic device mounting method | Tadahiko Sakai | 1998-09-08 |
| 5750199 | Apparatus and method for mounting soldering balls onto surfaces of electronic components | — | 1998-05-12 |
| 5713126 | Method of mounting electronic connector on an end of printed circuit board | — | 1998-02-03 |
| 5680984 | Apparatus and method for mounting soldering balls onto surfaces of electronic components | — | 1997-10-28 |
| 5666721 | Method of soldering an electronic connector on a printed circuit board | — | 1997-09-16 |
| 5657528 | Method of transferring conductive balls | Tadahiko Sakai | 1997-08-19 |
| 5655704 | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component | Teruaki Nishinaka | 1997-08-12 |