Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289428 | Element chip manufacturing method | Shogo Okita, Hidehiko Karasaki | 2022-03-29 |
| 8956499 | Plasma processing device | Tatsuhiro Mizukami, Masaru Nonomura | 2015-02-17 |
| 8757090 | Gas shower plate for plasma processing apparatus | Akira Nakagawa, Koji Kuga, Taiji Matano, Nobuhiro Sato | 2014-06-24 |
| 8668836 | Plasma processing device and method of monitoring plasma discharge state in plasma processing device | Tatsuhiro Mizukami, Masaru Nonomura | 2014-03-11 |
| 8585862 | Plasma processing device and plasma discharge state monitoring device | Tatsuhiro Mizukami, Masaru Nonomura | 2013-11-19 |
| 8558460 | Plasma processing apparatus | Masaru Nonomura, Hiroshi Haji | 2013-10-15 |
| 8450933 | Plasma processing apparatus | Masaru Nonomura, Hiroshi Haji | 2013-05-28 |
| 8383436 | Manufacturing method for semiconductor chips, and semiconductor chip | — | 2013-02-26 |
| 8293652 | Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method | Teruaki Nishinaka | 2012-10-23 |
| 8288284 | Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method | Hiroshi Haji | 2012-10-16 |
| 8158494 | Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer | Hiroshi Haji | 2012-04-17 |
| 8110481 | Method of segmenting semiconductor wafer | Atsushi Harikai | 2012-02-07 |
| 8026181 | Manufacturing method for semiconductor chips | Akira Nakagawa | 2011-09-27 |
| 8012805 | Manufacturing method for semiconductor chips, and semiconductor chip | Akira Nakagawa | 2011-09-06 |
| 7994026 | Plasma dicing apparatus and method of manufacturing semiconductor chips | Atsushi Harikai, Tetsuhiro Iwai | 2011-08-09 |
| 7989803 | Manufacturing method for semiconductor chips and semiconductor wafer | Teruaki Nishinaka | 2011-08-02 |
| 7964449 | Method for manufacturing semiconductor chip and method for processing semiconductor wafer | Hiroshi Haji | 2011-06-21 |
| 7927973 | Method for dividing semiconductor wafer and manufacturing method for semiconductor devices | Hiroshi Haji, Akira Nakagawa, Kazuhiro Noda | 2011-04-19 |
| 7923351 | Manufacturing method of semiconductor devices | — | 2011-04-12 |
| 7906410 | Method of manufacturing semiconductor chip using laser light and plasma dicing | Atsushi Harikai | 2011-03-15 |
| 7871901 | Manufacturing method for semiconductor chips | Akira Nakagawa | 2011-01-18 |
| 7767554 | Method of manufacturing semicondictor chip | Atsushi Harikai | 2010-08-03 |
| 7767551 | Method for fabricating semiconductor chip | Hiroshi Haji | 2010-08-03 |
| 7708860 | Plasma processing apparatus | Tetsuhiro Iwai, Akira Nakagawa | 2010-05-04 |
| 7678670 | TEG removing method in manufacturing method for semiconductor chips | Akira Nakagawa | 2010-03-16 |