Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7629228 | Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks | Hiroshi Haji, Teruaki Nishinaka | 2009-12-08 |
| 7488668 | Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions | Hiroshi Haji, Kazuhiro Noda, Akira Nakagawa, Teruaki Nishinaka | 2009-02-10 |
| 7138034 | Electrode member used in a plasma treating apparatus | Tetsuhiro Iwai, Hiroshi Haji, Shoji Sakemi, Taiji Matano, Nobuhiro Satou | 2006-11-21 |
| 7074720 | Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device | Tetsuhiro Iwai, Hiroshi Haji, Shoji Sakemi | 2006-07-11 |
| 7060531 | Method of cutting semiconductor wafer and protective sheet used in the cutting method | — | 2006-06-13 |
| 7056831 | Plasma processing apparatus and plasma processing method | Tetsuhiro Iwai | 2006-06-06 |
| 6969669 | Method of manufacturing semiconductor device and cutting apparatus for cutting semiconductor wafer | — | 2005-11-29 |
| 6921720 | Plasma treating apparatus and plasma treating method | Tetsuhiro Iwai, Junichi Terayama | 2005-07-26 |
| 6897128 | Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method | — | 2005-05-24 |
| 6867146 | Plasma processing method | Tetsuhiro Iwai | 2005-03-15 |
| 6852572 | Method of manufacturing semiconductor device | Hiroshi Haji, Shoji Sakemi, Mitsuru Ozono, Tadahiko Sakai | 2005-02-08 |
| 6784112 | Method for surface treatment of silicon based substrate | Tetsuhiro Iwai, Hiroshi Haji, Shoji Sakemi | 2004-08-31 |
| 6723651 | Plasma processing method | Tetsuhiro Iwai, Shoji Sakemi | 2004-04-20 |
| 6511895 | Semiconductor wafer turning process | Yutaka Koma, Hiroshi Haji, Tetsuhiro Iwai | 2003-01-28 |
| 6511917 | Plasma treatment apparatus and method | Hiroshi Haji | 2003-01-28 |
| 6418941 | Method of and apparatus for plasma cleaning of chip-mounted board | Tanemasa Asano | 2002-07-16 |
| 6340639 | Plasma process apparatus and plasma process method for substrate | Tetsuhiro Iwai, Hiroshi Haji | 2002-01-22 |
| 6313583 | Plasma processing apparatus and method | Isam Morisako, Hiroshi Haji | 2001-11-06 |
| 6239036 | Apparatus and method for plasma etching | Hiroshi Haji | 2001-05-29 |
| 5586713 | Method for wire bonding | Kouichi Takahashi | 1996-12-24 |
| 5522263 | Apparatus and method for inspecting soldering condition of electronic component by using ultrasonic oscillation | Kouichi Takahashi | 1996-06-04 |
| 5288008 | Method of forming inner lead bonding on a microchip | Hiroshi Haji | 1994-02-22 |
| 5207369 | Inner lead bonding apparatus | Hiroshi Haji | 1993-05-04 |