Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12275839 | Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure | Shigeru Yamatsu, Yasuhiro Suzuki | 2025-04-15 |
| 11623307 | Resin flux solder paste and mount structure | Koso Matsuno | 2023-04-11 |
| 10501628 | Resin composition, and electronic component and electronic device using same | HONAMI NISHINO | 2019-12-10 |
| 10440834 | Resin fluxed solder paste, and mount structure | Naomichi Ohashi, Yuki YOSHIOKA, Masato Mori, Yasuhiro Suzuki | 2019-10-08 |
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki, Hidenori Miyakawa | 2019-09-10 |
| 9881813 | Mounting structure and method for producing mounting structure | Yasuhiro Suzuki, Masato Mori, Naomichi Ohashi | 2018-01-30 |
| 9859190 | Resin structure, and electronic component and electronic device using the structure | HONAMI NAWA | 2018-01-02 |
| 9322541 | Cooling structure | Arata Kishi, HONAMI NAWA | 2016-04-26 |
| 8697237 | Thermosetting resin composition, method of manufacturing the same and circuit board | Taro Fukui, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi | 2014-04-15 |
| 6469074 | Composition of cyanate ester, epoxy resin and acid anhydride | Taro Fukui, Kenji Kitamura, Shinji Hashimoto, Naoki Kanagawa | 2002-10-22 |
| 6224674 | Seal coating mask for semiconductor element and method of use thereof | Taro Fukui, Kenji Kitamura | 2001-05-01 |