Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11674032 | Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor device | Shigeru Yamatsu, Kazuki Watanabe | 2023-06-13 |
| 11195769 | Thermosetting composition for use as underfill material, and semiconductor device | Shigeru Yamatsu | 2021-12-07 |
| 10870756 | Acrylic composition for encapsulation, sheet material, laminated sheet, cured object, semiconductor device, and process for producing semiconductor device | Shigeru Yamatsu, Kazuki Watanabe, Daisuke Sasaki | 2020-12-22 |
| 10797013 | Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device | Jin Jin, Shigeru Yamatsu, Daisuke Sasaki, Kazuki Watanabe | 2020-10-06 |
| 10703939 | Acrylic composition for sealing, sheet material, multilayer sheet, cured product, semiconductor device and method for manufacturing semiconductor device | Kazuki Watanabe, Shigeru Yamatsu, Daisuke Sasaki | 2020-07-07 |
| 8106523 | Liquid resin composition, semi-conductor device, and process of fabricating the same | Yasutaka Miyata | 2012-01-31 |
| 6469074 | Composition of cyanate ester, epoxy resin and acid anhydride | HIROHISA HINO, Taro Fukui, Kenji Kitamura, Shinji Hashimoto | 2002-10-22 |