Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8697237 | Thermosetting resin composition, method of manufacturing the same and circuit board | HIROHISA HINO, Hidenori Miyakawa, Atsushi Yamaguchi, Takayuki Higuchi | 2014-04-15 |
| 7230331 | Chip package structure and process for fabricating the same | Kai-Chi Chen, Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Tomoaki Nemoto | 2007-06-12 |
| 7061103 | Chip package structure | Kai-Chi Chen, Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Tomoaki Nemoto | 2006-06-13 |
| 7057277 | Chip package structure | Kai-Chi Chen, Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Tomoaki Nemoto | 2006-06-06 |
| 6469074 | Composition of cyanate ester, epoxy resin and acid anhydride | HIROHISA HINO, Kenji Kitamura, Shinji Hashimoto, Naoki Kanagawa | 2002-10-22 |
| 6224674 | Seal coating mask for semiconductor element and method of use thereof | HIROHISA HINO, Kenji Kitamura | 2001-05-01 |
| 6120716 | Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same | Takanori Kushida, Akio Kobayashi, Yosuke Obata, Hironori Ikeda, Masashi Nakamura | 2000-09-19 |
| 5401812 | Thermosetting polyimide composition, thermoset product thereof and manufacturing process thereof | Hiroshi Yamamoto | 1995-03-28 |