Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12202935 | Resin compound and resin composition containing the same | Meei-Yu Hsu, Chih-Hao Lin, Yi-Chun Chen | 2025-01-21 |
| D1052812 | Razor | — | 2024-11-26 |
| 11773222 | Curable composition and electronic device employing the same | Chih-Hao Lin, Yueh-Chuan Huang, Wen-Bin Chen | 2023-10-03 |
| 11591780 | Faucet aerator | Wen-Pin Chen | 2023-02-28 |
| 11319434 | Block copolymer, preparation method thereof, and thin film structure comprising the same | Meei-Yu Hsu, Yi-Chun Chen | 2022-05-03 |
| 11273410 | Extracted material for forward osmosis, preparation method thereof, and forward-osmosis water desalination system using the same | Yi-Chun Chen, Po-I Liu, Chia-Hua Ho, Yeu-Ding Chen, David Chiuni Wang +1 more | 2022-03-15 |
| 10717806 | Packaging material and film | Wen-Bin Chen, Shu-Chen Huang | 2020-07-21 |
| 10584139 | Multi-branched cationic phosphonium salt, forward osmosis extract employing the same and forward osmosis seawater desalination process | Yi-Chun Chen, Meei-Yu Hsu, Ya-Huei Ho | 2020-03-10 |
| 9773958 | Optical solid state prepolymer and molding composition | Ying-Nan Chan, Shu-Chen Huang, Chih-Hao Lin, Wen-Bin Chen | 2017-09-26 |
| 9617411 | Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same | Ying-Nan Chan, Shu-Chen Huang, Wen-Bin Chen, Chih-Hao Lin, Hsun-Tien Li | 2017-04-11 |
| 9540488 | Siloxane resin composition, and photoelectric device employing the same | Chih-Hao Lin, Wen-Bin Chen, Ying-Nan Chan, Shu-Chen Huang | 2017-01-10 |
| 8013039 | Encapsulant composition for a light-emitting diode | Chia-Wen Hsu, Hsun-Tien Li | 2011-09-06 |
| 7230331 | Chip package structure and process for fabricating the same | Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2007-06-12 |
| 7061103 | Chip package structure | Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2006-06-13 |
| 7057277 | Chip package structure | Shu-Chen Huang, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2006-06-06 |
| 6841094 | Fine conductive particles for making anisotropic conductive adhesive composition | Hsun-Tien Li, Shu-Chen Huang | 2005-01-11 |
| 6821818 | Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly | Hsun-Tien Li | 2004-11-23 |
| 6627684 | Dielectric compositions having two steps of laminating temperatures | Tzong-Ming Lee, Hsun-Tien Li, Mei-Ling Chen | 2003-09-30 |