Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9617411 | Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same | Ying-Nan Chan, Shu-Chen Huang, Wen-Bin Chen, Kai-Chi Chen, Chih-Hao Lin | 2017-04-11 |
| 8721919 | Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom | Shu-Chen Huang, Wen-Bin Chen, Chia-Wen Hsu | 2014-05-13 |
| 8440774 | Transparent silicone epoxy composition | Chich-Haw Lin, Shu-Chen Huang | 2013-05-14 |
| 8013039 | Encapsulant composition for a light-emitting diode | Chia-Wen Hsu, Kai-Chi Chen | 2011-09-06 |
| 7230331 | Chip package structure and process for fabricating the same | Kai-Chi Chen, Shu-Chen Huang, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2007-06-12 |
| 7061103 | Chip package structure | Kai-Chi Chen, Shu-Chen Huang, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2006-06-13 |
| 7057277 | Chip package structure | Kai-Chi Chen, Shu-Chen Huang, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto | 2006-06-06 |
| 6841094 | Fine conductive particles for making anisotropic conductive adhesive composition | Shu-Chen Huang, Kai-Chi Chen | 2005-01-11 |
| 6821818 | Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly | Kai-Chi Chen | 2004-11-23 |
| 6627684 | Dielectric compositions having two steps of laminating temperatures | Tzong-Ming Lee, Kai-Chi Chen, Mei-Ling Chen | 2003-09-30 |