SH

Shu-Chen Huang

IT ITRI: 15 patents #233 of 9,619Top 3%
PA Panasonic: 3 patents #7,617 of 21,108Top 40%
FI Food Industry Research And Development Institute: 2 patents #43 of 185Top 25%
RE Risun Expanse: 1 patents #3 of 4Top 75%
TSMC: 1 patents #8,466 of 12,232Top 70%
Overall (All Time): #222,017 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
10717806 Packaging material and film Wen-Bin Chen, Kai-Chi Chen 2020-07-21
9782444 Preparation and use of fish skin fermentation liquid obtained by fermenting fish skin with Aspergillus PEI-JOU LIU, Chiao-Ming Liao, Hing-Yuen Chan 2017-10-10
9773958 Optical solid state prepolymer and molding composition Ying-Nan Chan, Chih-Hao Lin, Wen-Bin Chen, Kai-Chi Chen 2017-09-26
9617411 Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same Ying-Nan Chan, Wen-Bin Chen, Kai-Chi Chen, Chih-Hao Lin, Hsun-Tien Li 2017-04-11
9540488 Siloxane resin composition, and photoelectric device employing the same Chih-Hao Lin, Wen-Bin Chen, Ying-Nan Chan, Kai-Chi Chen 2017-01-10
8784912 Fermented composition of mung bean hulls, method for forming thereof, and anti-oxidation and anti-inflammation composition using the same Hing-Yuen Chan, Chiao-Ming Liao, Li-Chuan Liao, Shiaw-Min Hwang 2014-07-22
8721919 Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom Wen-Bin Chen, Hsun-Tien Li, Chia-Wen Hsu 2014-05-13
8609297 Flat fuel cell assembly and fabrication thereof Yeu-Shih Yen, Chiou-Chu Lai, Ju-Pei Chen, Ku-Yin Ka 2013-12-17
8440774 Transparent silicone epoxy composition Chich-Haw Lin, Hsun-Tien Li 2013-05-14
7230331 Chip package structure and process for fabricating the same Kai-Chi Chen, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto 2007-06-12
7179664 Method for generating work-in-process schedules Gwo-Chiang Fang 2007-02-20
7061103 Chip package structure Kai-Chi Chen, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto 2006-06-13
7057277 Chip package structure Kai-Chi Chen, Hsun-Tien Li, Tzong-Ming Lee, Taro Fukui, Tomoaki Nemoto 2006-06-06
6841094 Fine conductive particles for making anisotropic conductive adhesive composition Hsun-Tien Li, Kai-Chi Chen 2005-01-11
6707223 Stator assembly structure 2004-03-16
5710459 Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability Kun Teng, Shin-Tang Jian 1998-01-20
D380447 Ethernet switching hub Chi Chen 1997-07-01
5557663 Multi-media communication system with integrated and coherent audio-video user interface allowing flexible image input Yu-Lin Chao, Jeng-Yeong Tyan 1996-09-17
D373355 Video telephone Yu-Lin Chao, Jeng-Yeong Tyan 1996-09-03
5260835 Vehicle rear view mirror 1993-11-09