Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6120716 | Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same | Akio Kobayashi, Yosuke Obata, Hironori Ikeda, Taro Fukui, Masashi Nakamura | 2000-09-19 |