Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9656351 | Solder material and connected structure | Kazuhiro Matsugi | 2017-05-23 |
| 8598464 | Soldering material and electronic component assembly | Shigeaki Sakatani, Akio Furusawa, Taichi Nakamura | 2013-12-03 |
| 8227090 | Bonding material, electronic component, bonding structure and electronic device | Akio Furusawa, Shigeki Sakaguchi, Kimiaki Nakaya | 2012-07-24 |
| 8132707 | Flow soldering apparatus and flow soldering method using a water content sensor | Kimiaki Nakaya, Arata Kishi | 2012-03-13 |
| 7780057 | Soldering apparatus and soldering method | Arata Kishi, Kimiaki Nakaya | 2010-08-24 |
| 7540078 | Method for recycling wastes of an electrical appliance | Shunji Hibino, Masato Hirano, Atsushi Yamaguchi, Mikiya Nakata | 2009-06-02 |
| 7176402 | Method and apparatus for processing electronic parts | Tomohiro Okumura, Hiroshi Kawazoe, Mitsuo Saitoh, Akio Furusawa | 2007-02-13 |
| 7047635 | Connecting material and connecting method | Takaharu Gamo, Shunji Hibino, Yoshio Morita, Mikiya Nakata | 2006-05-23 |
| 6805282 | Flow soldering process and apparatus | Yasuji Kawashima, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji, Shoshi Kabashima +2 more | 2004-10-19 |
| 6702175 | Method of soldering using lead-free solder and bonded article prepared through soldering by the method | Kazumi Matsushige, Toshihisa Horiuchi, Takashi Ikari, Masato Hirano, Shunji Hibino +1 more | 2004-03-09 |
| 6657135 | Connection structure and electronic circuit board | Masuo Koshi, Kenichiro Todoroki, Shunji Hibino, Hiroaki Takano, Mikiya Nakata +1 more | 2003-12-02 |
| 6607116 | Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering | Shunji Hibino, Yukio Maeda, Shoshi Kabashima, Mikiya Nakata | 2003-08-19 |
| 6428745 | Solder, solder paste and soldering method | Atsushi Yamaguchi, Tetsuo Fukushima, Akio Furusawa | 2002-08-06 |
| 6325279 | Solder alloy of electrode for joining electronic parts and soldering method | Yoshinori Sakai, Atsushi Yamaguchi | 2001-12-04 |
| 6267823 | Solder, solder paste and soldering method | Atsushi Yamaguchi, Tetsuo Fukushima, Akio Furusawa | 2001-07-31 |
| 6077477 | Solder alloy of electrode for joining electronic parts and soldering method | Yoshinori Sakai, Atsushi Yamaguchi | 2000-06-20 |
| 6074894 | Mounting method of semiconductor device | Atsushi Yamaguchi | 2000-06-13 |
| 6052893 | Process for manufacturing a resin-encapsulated electronic product | Koichi Yoshida, Tetsuo Fukushima | 2000-04-25 |
| 5962133 | Solder, electronic component mounted by soldering, and electronic circuit board | Atsushi Yamaguchi, Tetsuo Fukushima, Akio Furusawa | 1999-10-05 |
| 5858481 | Electronic circuit substrate | Tetsuo Fukushima, Koichi Yoshida | 1999-01-12 |
| 5743007 | Method of mounting electronics component | Hiroaki Onishi, Haruto Nagata, Masato Hirano | 1998-04-28 |
| 5498575 | Bonding film member and mounting method of electronic component | Hiroaki Onishi | 1996-03-12 |
| 5198655 | Image reading device having a light waveguide means widened toward an end nearest to an image surface | Tetsuo Fukushima, Tokuhito Hamane, Junji Ikeda, Yukio Maeda | 1993-03-30 |
| 5136150 | Image sensor having light guides for communication with image plane | Tetsuo Fukushima, Tokuhito Hamane, Junji Ikeda, Yukio Maeda | 1992-08-04 |
| 5118458 | Method for molding an article integrated with a multi-layer flexible circuit and an apparatus for carrying out the method | Munekazu Nishihara, Tetsuo Fukushima, Junji Ikeda | 1992-06-02 |