Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515281 | Bonded structure and bonding material | Shinji Ishitani, Kiyohiro Hine | 2022-11-29 |
| 11515280 | Mounting structure and nanoparticle mounting material | Kiyohiro Hine, Hidetoshi Kitaura | 2022-11-29 |
| 11476399 | Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device | Hidetoshi Kitaura, Kiyohiro Hine | 2022-10-18 |
| 11318534 | Metal microparticle production method and metal microparticle production device | Kiyohiro Hine, Shinji Ishitani, Misato Takahashi | 2022-05-03 |
| 11135683 | Solder alloy and junction structure using same | Hidetoshi Kitaura, Kiyohiro Hine | 2021-10-05 |
| 10960496 | Solder alloy and package structure using same | SHINNOSUKE AKIYAMA, Kiyohiro Hine, Hidetoshi Kitaura | 2021-03-30 |
| 10636724 | Mount structure | Kiyohiro Hine, Hidetoshi Kitaura, Kazuki Sakai | 2020-04-28 |
| 10493567 | Solder alloy and bonded structure using the same | Kazuki Sakai, Hidetoshi Kitaura, Kiyohiro Hine | 2019-12-03 |
| 10170442 | Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer | Kiyohiro Hine, Hidetoshi Kitaura, Kazuki Sakai | 2019-01-01 |
| 10068869 | Mounting structure and BGA ball | Kiyohiro Hine, Masato Mori, Taichi Nakamura, Hidetoshi Kitaura | 2018-09-04 |
| 9981348 | Solder alloy and mounted structure using same | Kiyohiro Hine, Hidetoshi Kitaura | 2018-05-29 |
| 9789569 | Solder material and bonded structure | Kiyohiro Hine, Masato Mori, Taichi Nakamura | 2017-10-17 |
| 9386699 | Mounted structure and manufacturing method of mounted structure | Kiyohiro Hine, Masato Mori | 2016-07-05 |
| 9199340 | Solder material and bonded structure | Kiyohiro Hine, Masato Mori, Taichi Nakamura | 2015-12-01 |
| 8810035 | Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body | Taichi Nakamura, Shigeaki Sakatani, Hidetoshi Kitaura, Yukihiro Ishimaru | 2014-08-19 |
| 8691377 | Semiconductor device | Taichi Nakamura, Shigeaki Sakatani, Hidetoshi Kitaura, Takahiro Matsuo | 2014-04-08 |
| 8598464 | Soldering material and electronic component assembly | Shigeaki Sakatani, Kenichiro Suetsugu, Taichi Nakamura | 2013-12-03 |
| 8552307 | Mounting structure | Kiyohiro Hine, Shigeaki Sakatani | 2013-10-08 |
| 8421246 | Joint structure and electronic component | Shigeaki Sakatani, Taichi Nakamura, Takahiro Matsuo | 2013-04-16 |
| 8338966 | Joint structure, joining material, and method for producing joining material containing bismuth | Shigeaki Sakatani, Hidetoshi Kitaura, Taichi Nakamura, Takahiro Matsuo | 2012-12-25 |
| 8268718 | Bonded structure and manufacturing method for bonded structure | Taichi Nakamura, Shigeaki Sakatani, Hidetoshi Kitaura, Takahiro Matsuo | 2012-09-18 |
| 8227090 | Bonding material, electronic component, bonding structure and electronic device | Kenichiro Suetsugu, Shigeki Sakaguchi, Kimiaki Nakaya | 2012-07-24 |
| 7973412 | Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead | Seiji Fujiwara, Yoshihiro Tomita, Kenichirou Suetugu | 2011-07-05 |
| 7176402 | Method and apparatus for processing electronic parts | Tomohiro Okumura, Kenichiro Suetsugu, Hiroshi Kawazoe, Mitsuo Saitoh | 2007-02-13 |
| 6428745 | Solder, solder paste and soldering method | Atsushi Yamaguchi, Tetsuo Fukushima, Kenichiro Suetsugu | 2002-08-06 |