Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6805282 | Flow soldering process and apparatus | Yasuji Kawashima, Kenichiro Suetsugu, Shunji Hibino, Hiroaki Takano, Tatsuo Okuji +2 more | 2004-10-19 |
| 6607116 | Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering | Kenichiro Suetsugu, Shunji Hibino, Yukio Maeda, Mikiya Nakata | 2003-08-19 |
| 4681528 | Valve nozzle for injection molding | Yoshio Maruyama | 1987-07-21 |
| 4524507 | Laminated core producing apparatus | Yoshihumi Hara, Hiroji Takano, Mikio Hasegawa | 1985-06-25 |