Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8664773 | Mounting structure of semiconductor package component and manufacturing method therefor | Atsushi Yamaguchi, Hiroe Kowada, Ryo Kuwabara, Naomichi Ohashi | 2014-03-04 |
| 8344268 | Electronic component packaging structure having two-layer moisture-proof coating and method for manufacturing the same | Hidenori Miyakawa, Atsushi Yamaguchi, Hiroe Kowada, Koso Matsuno | 2013-01-01 |
| 7785500 | Electrically conductive adhesive | Atsushi Yamaguchi, Hidenori Miyakawa, Takayuki Higuchi, Koso Matsuno | 2010-08-31 |