Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7071090 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Hiroyuki Otani | 2006-07-04 |
| 6894387 | Semiconductor element having protruded bump electrodes | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Hiroyuki Otani | 2005-05-17 |
| 6455099 | Method and device for applying sealant to IC having bumps | Kouhei Enchi, Hiroyuki Yoshida | 2002-09-24 |
| 6370750 | Component affixing method and apparatus | Nobuya Matsumura, Shoji Sato, Akihiro Yamamoto, Yoichi Nakamura | 2002-04-16 |
| 6332268 | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Makoto Imanishi, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada, Takahiro Yonezawa +1 more | 2001-12-25 |
| 6207549 | Method of forming a ball bond using a bonding capillary | Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Hiroyuki Otani | 2001-03-27 |
| 5791484 | Assembly of chip parts | Junji Ikeda, Osamu Yamazaki, Youichi Nakamura | 1998-08-11 |
| 5744382 | Method of packaging electronic chip component and method of bonding of electrode thereof | Kazuhiro Mori, Keiji Saeki, Takashi Akiguchi | 1998-04-28 |
| 5646439 | Electronic chip component with passivation film and organic protective film | Kazuhiro Mori, Keiji Saeki, Takashi Akiguchi | 1997-07-08 |
| 5622590 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1997-04-22 |
| 5550408 | Semiconductor device | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1996-08-27 |
| 5436503 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Masahide Tsukamoto, Seiichi Nakatani +1 more | 1995-07-25 |
| 5240170 | Method for bonding lead of IC component with electrode | Kazuto Nishida, Kazuhiro Nobori, Keiji Saeki | 1993-08-31 |
| 5116228 | Method for bump formation and its equipment | Akira Kabeshita | 1992-05-26 |
| 5012388 | Electrode structure of a chip type electronic component | Akira Kabeshita, Tokuhito Hamane | 1991-04-30 |
| 4676864 | Bonding method of semiconductor device | Yukio Maeda, Shuichi Murakami | 1987-06-30 |
| 4510011 | Strip deforming apparatus | Yusaku Azuma, Shinji Kawaida | 1985-04-09 |
| 4447014 | Tire component assembly | Yusaku Azuma, Chiaki Ozawa | 1984-05-08 |