Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7059039 | Method for producing printed wiring boards | Masanaru Hasegawa, Hideo Hatanaka | 2006-06-13 |
| 6888072 | Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same | Kazufumi Yamaguchi, Takeshi Shimamoto, Fumikazu Tateishi | 2005-05-03 |
| 6748652 | Circuit board and method of manufacturing the same | Daizou Andou, Toshio Sugawa, Tadashi Nakamura, Hideki Higashitani | 2004-06-15 |
| 6703565 | Printed wiring board | Masanaru Hasegawa, Hideo Hatanaka | 2004-03-09 |
| 6683260 | Multilayer wiring board embedded with transmission line conductor | Takeshi Shimamoto, Kazufumi Yamaguchi, Fumikazu Tateishii, Yutaka Taguchi | 2004-01-27 |
| 6565954 | Circuit board and method of manufacturing the same | Daizou Andou, Toshio Sugawa, Tadashi Nakamura, Hideki Higashitani | 2003-05-20 |
| 6532651 | Circuit board and method of manufacturing the same | Daizou Andou, Toshio Sugawa, Tadashi Nakamura, Hideki Higashitani | 2003-03-18 |
| 6513236 | Method of manufacturing bump-component mounted body and device for manufacturing the same | — | 2003-02-04 |
| 6465082 | Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body | Hiroaki Takezawa, Minehiro Itagaki, Yoshihiro Bessho, Hideo Hatanaka, Yasushi Fukumura +2 more | 2002-10-15 |
| 6281448 | Printed circuit board and electronic components | — | 2001-08-28 |
| 6197407 | Circuit board and method of manufacturing the same | Daizou Andou, Toshio Sugawa, Tadashi Nakamura, Hideki Higashitani | 2001-03-06 |
| 6195882 | Method for producing printed wiring boards | Masanaru Hasegawa, Hideo Hatanaka | 2001-03-06 |
| 6192581 | Method of making printed circuit board | — | 2001-02-27 |
| 6171946 | Pattern formation method for multi-layered electronic components | — | 2001-01-09 |
| 6045897 | Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same | Masayuki Sakai, Hideo Hatanaka, Seiichi Nakatani, Masayuki Okano, Tamao Kojima | 2000-04-04 |
| 5960538 | Printed circuit board | Kouji Kawakita, Seiichi Nakatani | 1999-10-05 |
| 5858884 | Nonwoven fabric cloth substrate for printed wiring boards, and prepreg using the same | Masayuki Sakai, Hideo Hatanaka, Seiichi Nakatani, Masayuki Okano, Tamao Kojima | 1999-01-12 |
| 5841194 | Chip carrier with peripheral stiffener and semiconductor device using the same | — | 1998-11-24 |
| 5817404 | Printed circuit board | Kouji Kawakita, Seiichi Nakatani | 1998-10-06 |
| 5635006 | Pattern forming method and ink compostion | Hirotoshi Watanabe, Yutaka Nishimura, Koji Matsuo, Noboru Aikawa | 1997-06-03 |
| 5622590 | Semiconductor device and method of manufacturing the same | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Seiichi Nakatani, Keiji Saeki +1 more | 1997-04-22 |
| 5588207 | Method of manufacturing two-sided and multi-layered printed circuit boards | Kouji Kawakita, Yasukiho Horio, Seiichi Nakatani, Akihito Hatakeyama | 1996-12-31 |
| 5551626 | Diffusion joining method and a paste used therefor | Yo Hasegawa, Masahiro Nagasawa | 1996-09-03 |
| 5550408 | Semiconductor device | Yoshinobu Kunitomo, Makoto Nozu, Yasuyuki Sakashita, Seiichi Nakatani, Keiji Saeki +1 more | 1996-08-27 |
| 5481795 | Method of manufacturing organic substrate used for printed circuits | Akihito Hatakeyama, Hiroshi Sogo, Tamao Kojima, Yasuhiko Horio, Yasushi Fukumura | 1996-01-09 |