Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6890789 | Photo-semiconductor module and method for manufacturing the same | Masahiro Ono | 2005-05-10 |
| 6803639 | Photo-semiconductor module and method for manufacturing the same | Masahiro Ono | 2004-10-12 |
| 6749889 | Method for producing mounting structure for an electronic component | Hiroaki Takezawa, Tsutomu Mitani, Yoshihiro Bessho, Kazuo Eda | 2004-06-15 |
| 6723251 | Method for planarizing circuit board and method for manufacturing semiconductor device | Yoshihiro Tomuro, Satoru Yuhaku, Kazuyoshi Amami | 2004-04-20 |
| 6703262 | Method for planarizing circuit board and method for manufacturing semiconductor device | Yoshihiro Tomuro, Satoru Yuhaku, Kazuyoshi Amami | 2004-03-09 |
| 6694613 | Method for producing a printed-circuit board having projection electrodes | Yoshifumi Nakamura, Hiroaki Takezawa, Yoshihiro Bessho, Tsukasa Shiraishi | 2004-02-24 |
| 6569512 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Tsutomu Mitani, Yoshihiro Bessho, Kazuo Eda | 2003-05-27 |
| 6538315 | Semiconductor device and method of manufacturing same | Yoshihiro Bessho | 2003-03-25 |
| 6488869 | Conductive paste, its manufacturing method, and printed wiring board using the same | Hiroaki Takezawa, Yoshihiro Bessho | 2002-12-03 |
| 6468448 | Conductive composition, conductive adhesive, and their mounting structure | Kazuyoshi Amami, Emiko Igaki | 2002-10-22 |
| 6465082 | Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body | Hiroaki Takezawa, Masahide Tsukamoto, Yoshihiro Bessho, Hideo Hatanaka, Yasushi Fukumura +2 more | 2002-10-15 |
| 6376051 | Mounting structure for an electronic component and method for producing the same | Hiroaki Takezawa, Tsutomu Mitani, Yoshihiro Bessho, Kazuo Eda | 2002-04-23 |
| 6372548 | Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate | Yoshihiro Bessho | 2002-04-16 |
| 6372547 | Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board | Yoshifumi Nakamura, Yoshihiro Bessho | 2002-04-16 |
| 6365499 | Chip carrier and method of manufacturing and mounting the same | Yoshifumi Nakamura, Yoshihiro Bessho | 2002-04-02 |
| 6300576 | Printed-circuit board having projection electrodes and method for producing the same | Yoshifumi Nakamura, Hiroaki Takezawa, Yoshihiro Bessho, Tsukasa Shiraishi | 2001-10-09 |
| 6229209 | Chip carrier | Yoshifumi Nakamura, Yoshihiro Bessho | 2001-05-08 |
| 6207550 | Method for fabricating bump electrodes with a leveling step for uniform heights | Nobuhiro Hase, Yoshifumi Nakamura, Satoru Yuhaku, Hiroaki Takezawa, Yoshihiro Bessho | 2001-03-27 |
| 5688441 | Thixotropic conductive paste | Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano | 1997-11-18 |
| 5662755 | Method of making multi-layered ceramic substrates | Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Yoshifumi Nakamura +1 more | 1997-09-02 |
| 5547530 | Method of manufacturing a ceramic substrate | Yoshifumi Nakamura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura | 1996-08-20 |
| 5525402 | Ceramic substrate and manufacturing method thereof | Yoshifumi Nakamura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura | 1996-06-11 |
| 5503777 | Thixotropic conductive paste | Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano | 1996-04-02 |
| 5496619 | Assembly formed from conductive paste and insulating paste | Kazuyuki Okano, Suzushi Kimura, Seiichi Nakatani, Yoshihiro Bessho, Satoru Yuhaku +2 more | 1996-03-05 |
| 5407473 | Conductive ink | Kazuhiro Miura, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Yoshifumi Nakamura +1 more | 1995-04-18 |