Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818461 | Method of producing mounting structure and mounting structure produced by the same | Tsukasa Shiraishi, Yoshihiro Bessho | 2004-11-16 |
| 6756663 | Semiconductor device including wiring board with three dimensional wiring pattern | Tsukasa Shiraishi, Tsutomu Mitani, Yoshihiro Bessho | 2004-06-29 |
| 6723251 | Method for planarizing circuit board and method for manufacturing semiconductor device | Minehiro Itagaki, Yoshihiro Tomuro, Satoru Yuhaku | 2004-04-20 |
| 6703262 | Method for planarizing circuit board and method for manufacturing semiconductor device | Minehiro Itagaki, Yoshihiro Tomuro, Satoru Yuhaku | 2004-03-09 |
| 6525414 | Semiconductor device including a wiring board and semiconductor elements mounted thereon | Tsukasa Shiraishi, Tsutomu Mitani, Yoshihiro Bessho | 2003-02-25 |
| 6468448 | Conductive composition, conductive adhesive, and their mounting structure | Emiko Igaki, Minehiro Itagaki | 2002-10-22 |
| 6429382 | Electrical mounting structure having an elution preventive film | Hiroaki Takezawa, Tsukasa Shiraishi, Yoshihiro Bessho | 2002-08-06 |
| 5364253 | Magnetic circuit component molding device | Kiyoshi Kojima, Hiroshi Ueda, Shizuo Furuyama, Yoshihiro Hara, Kyoichi Hasegawa +1 more | 1994-11-15 |