Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9076752 | Semiconductor device and method for manufacturing the same | Toshiyuki Kojima, Norihito Tsukahara, Takayuki Hirose, Keiko Ikuta, Masayoshi Koyama | 2015-07-07 |
| 8822753 | Absorbent article | Yusuke Kawakami | 2014-09-02 |
| 8353102 | Wiring board connection method | Masayoshi Koyama | 2013-01-15 |
| 8063486 | Circuit board, method for manufacturing the same, and semiconductor device | Koichi Hirano, Seiichi Nakatani, Tatsuo Ogawa | 2011-11-22 |
| 7963310 | Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film | Seiichi Nakatani | 2011-06-21 |
| 7850803 | Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film | Seiichi Nakatani | 2010-12-14 |
| 7752749 | Electronic component mounting method and electronic component mounting device | Yukihiro Ishimaru, Shinobu Masuda, Satoru Tomekawa | 2010-07-13 |
| 7649267 | Package equipped with semiconductor chip and method for producing same | Yukihiro Ishimaru, Seiji Karashima, Seiichi Natkatani, Hiroki Yabe | 2010-01-19 |
| 6909180 | Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same | Masahiro Ono | 2005-06-21 |
| 6818461 | Method of producing mounting structure and mounting structure produced by the same | Kazuyoshi Amami, Yoshihiro Bessho | 2004-11-16 |
| 6756663 | Semiconductor device including wiring board with three dimensional wiring pattern | Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho | 2004-06-29 |
| 6694613 | Method for producing a printed-circuit board having projection electrodes | Yoshifumi Nakamura, Minehiro Itagaki, Hiroaki Takezawa, Yoshihiro Bessho | 2004-02-24 |
| 6525414 | Semiconductor device including a wiring board and semiconductor elements mounted thereon | Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho | 2003-02-25 |
| 6452280 | Flip chip semiconductor apparatus with projecting electrodes and method for producing same | Yoshihiro Bessho | 2002-09-17 |
| 6429382 | Electrical mounting structure having an elution preventive film | Kazuyoshi Amami, Hiroaki Takezawa, Yoshihiro Bessho | 2002-08-06 |
| 6369450 | Method of producing mounting structure and mounting structure produced by the same | Kazuyoshi Amani, Yoshihiro Bessho | 2002-04-09 |
| 6300576 | Printed-circuit board having projection electrodes and method for producing the same | Yoshifumi Nakamura, Minehiro Itagaki, Hiroaki Takezawa, Yoshihiro Bessho | 2001-10-09 |
| 6284640 | Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device | Masahiro Ono, Yoshihiro Bessho, Kazuo Eda | 2001-09-04 |
| 6154940 | Electronic part and a method of production thereof | Keiji Onishi, Hideki Iwaki, Shun-ichi Seki, Yutaka Taguchi, Yoshihiro Bessho +2 more | 2000-12-05 |
| 5920142 | Electronic part and a method of production thereof | Keiji Onishi, Hideki Iwaki, Shun-ichi Seki, Yutaka Taguchi, Yoshihiro Bessho +2 more | 1999-07-06 |