Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9426899 | Electronic component assembly | Takashi Kitae, Seiichi Nakatani | 2016-08-23 |
| 8887383 | Electrode structure and method for forming bump | Yasushi Taniguchi, Seiichi Nakatani, Takashi Kitae, Kenichi Hotehama | 2014-11-18 |
| 8709293 | Flip-chip mounting resin composition and bump forming resin composition | Takashi Kitae, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani, Shingo Komatsu +1 more | 2014-04-29 |
| 8691683 | Flip-chip mounting method and bump formation method | Koichi Hirano, Takashi Ichiryu, Yoshihiro Tomita, Seiichi Nakatani | 2014-04-08 |
| 8501583 | Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates | Takashi Kitae, Susumu Sawada, Seiichi Nakatani | 2013-08-06 |
| 8297488 | Bump forming method using self-assembling resin and a wall surface | Yasushi Taniguchi, Seiichi Nakatani, Kenichi Hotehama, Takashi Kitae, Susumu Sawada | 2012-10-30 |
| 8283246 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2012-10-09 |
| 8097958 | Flip chip connection structure having powder-like conductive substance and method of producing the same | Susumu Sawada, Seiichi Nakatani, Takashi Kitae | 2012-01-17 |
| 8071425 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-12-06 |
| 8064213 | Module with a built-in component, and electronic device with the same | Toshiyuki Asahi, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama | 2011-11-22 |
| 8012801 | Flip chip mounting process and flip chip assembly | Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2011-09-06 |
| 7951700 | Flip chip mounting method and bump forming method | Takashi Kitae, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2011-05-31 |
| 7927997 | Flip-chip mounting method and bump formation method | Koichi Hirano, Takashi Ichiryu, Yoshihiro Tomita, Seiichi Nakatani | 2011-04-19 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2011-04-12 |
| 7919357 | Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates | Susumu Sawada, Seiichi Nakatani, Takashi Kitae | 2011-04-05 |
| 7911064 | Mounted body and method for manufacturing the same | Shingo Komatsu, Seiichi Nakatani, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita | 2011-03-22 |
| 7910403 | Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same | Koichi Hirano, Takashi Ichiryu, Yoshihiro Tomita | 2011-03-22 |
| 7905011 | Bump forming method and bump forming apparatus | Yasushi Taniguchi, Seiichi Nakatani, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama | 2011-03-15 |
| 7875496 | Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2011-01-25 |
| 7820021 | Flip chip mounting method and method for connecting substrates | Takashi Kitae, Seiichi Nakatani | 2010-10-26 |
| 7799607 | Process for forming bumps and solder bump | Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2010-09-21 |
| 7759162 | Flip chip mounting process and flip chip assembly | Yoshihisa Yamashita, Satoru Tomekawa, Takashi Kitae, Seiichi Nakatani | 2010-07-20 |
| 7754529 | Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method | Yoshihiro Tomita, Koichi Hirano, Takashi Ichiryu, Toshio Fujii | 2010-07-13 |
| 7748110 | Method for producing connection member | Toshiyuki Asahi, Takashi Ichiryu, Seiichi Nakatani, Tousaku Nishiyama, Koichi Hirano +3 more | 2010-07-06 |
| 7732920 | Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus | Seiichi Nakatani, Takashi Kitae, Yoshihisa Yamashita, Takashi Ichiryu | 2010-06-08 |